Inpainting-based error concealment for low-delay video communication

Ahmed Aldahdooh, Marcus Barkowsky, David Bull, Patrick Le Callet

Research output: Chapter in Book/Report/Conference proceedingConference Contribution (Conference Proceeding)

1 Citation (Scopus)
113 Downloads (Pure)

Abstract

Error concealment (EC) is one of the target applications of
inpainting techniques. Some methods combine the estimated
lost motion vectors (MVs) with the exemplar-based inpainting technique to recover the lost regions. Due to the erroneous
motion vectors that might indicate a moving object as background object and vice versa, these methods are still showing visual artifacts in the recovered regions. In this paper, a
concept of motion map that can be easily generated in the decoder side is introduced and it is combined with the exemplarbased inpainting technique. The proposed method introduces an adaptive search window size that trades-off the quality and complexity. Moreover, an optional blending technique is proposed to limit the spatio-temporal artifacts. Experiments
show that the proposed method improves the visual quality
with 5dB on average relative to the state-of-the-art inpaintingbased EC method.
Original languageEnglish
Title of host publication2017 IEEE International Conference on Acoustics, Speech and Signal Processing (ICASSP)
PublisherInstitute of Electrical and Electronics Engineers (IEEE)
Pages1632-1636
Number of pages6
ISBN (Electronic)9781509041176
ISBN (Print)9781509041183
DOIs
Publication statusE-pub ahead of print - 19 Jun 2017

Publication series

NameIEEE International Conference on Acoustics, Speech and Signal Processing (ICASSP)
PublisherIEEE
ISSN (Print)2379-190X

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  • Cite this

    Aldahdooh, A., Barkowsky, M., Bull, D., & Le Callet, P. (2017). Inpainting-based error concealment for low-delay video communication. In 2017 IEEE International Conference on Acoustics, Speech and Signal Processing (ICASSP) (pp. 1632-1636). (IEEE International Conference on Acoustics, Speech and Signal Processing (ICASSP)). Institute of Electrical and Electronics Engineers (IEEE). https://doi.org/10.1109/ICASSP.2017.7952433