Interconnect design and analysis for Through Silicon Interposers (TSIs)

Joseph Romen Cubillo, Roshan Weerasekera, Zaw Zaw Oo, En-Xiao Liu, Bob Conn, Surya Bhattacharya, Robert Patti

Research output: Chapter in Book/Report/Conference proceeding › Conference Contribution (Conference Proceeding)

18 Citations (Scopus)

Original language	Undefined/Unknown
Title of host publication	2011 IEEE International 3D Systems Integration Conference (3DIC), 2011 IEEE International
Pages	1-6
Number of pages	6
DOIs	https://doi.org/10.1109/3DIC.2012.6263039
Publication status	Published - 2012

Research Groups and Themes

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title = "Interconnect design and analysis for Through Silicon Interposers (TSIs)",

author = "Cubillo, {Joseph Romen} and Roshan Weerasekera and Oo, {Zaw Zaw} and En-Xiao Liu and Bob Conn and Surya Bhattacharya and Robert Patti",

year = "2012",

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AU - Cubillo, Joseph Romen

AU - Weerasekera, Roshan

AU - Oo, Zaw Zaw

AU - Liu, En-Xiao

AU - Conn, Bob

AU - Bhattacharya, Surya

AU - Patti, Robert

PY - 2012

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BT - 2011 IEEE International 3D Systems Integration Conference (3DIC), 2011 IEEE International

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