Investigation of heat transfer and thermal stresses of novel thermal management system integrated with vapour chamber for IGBT power module

TY - JOUR

T1 - Investigation of heat transfer and thermal stresses of novel thermal management system integrated with vapour chamber for IGBT power module

AU - Chen, Yiyi

AU - Li, Bo

AU - Wang, Xin

AU - Yan, Yuying

AU - Wang, Yangang

AU - Qi, Fang

PY - 2019/5

Y1 - 2019/5

UR - https://doi.org/10.1016/j.tsep.2019.01.007

U2 - 10.1016/j.tsep.2019.01.007

DO - 10.1016/j.tsep.2019.01.007

M3 - Article (Academic Journal)

SN - 2451-9049

JO - Thermal Science and Engineering Progress

JF - Thermal Science and Engineering Progress

ER -