Investigation of through-thickness displacement fields by electronic speckle pattern interferometry (ESPI)

AR Rashid, MR Wisnom, KD Potter, R Burguete, N Gauge

Research output: Chapter in Book/Report/Conference proceedingConference Contribution (Conference Proceeding)

Translated title of the contributionInvestigation of through-thickness displacement fields by electronic speckle pattern interferometry (ESPI)
Original languageEnglish
Title of host publicationInternational Conference on Composites Testing and Model Identification Chalons-en-Champagne, France
Publication statusPublished - Jan 2003

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