Translated title of the contribution | Investigation of through-thickness displacement fields by electronic speckle pattern interferometry (ESPI) |
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Original language | English |
Title of host publication | International Conference on Composites Testing and Model Identification Chalons-en-Champagne, France |
Publication status | Published - Jan 2003 |
Investigation of through-thickness displacement fields by electronic speckle pattern interferometry (ESPI)
AR Rashid, MR Wisnom, KD Potter, R Burguete, N Gauge
Research output: Chapter in Book/Report/Conference proceeding › Conference Contribution (Conference Proceeding)