Investigation of through-thickness displacement fields by electronic speckle pattern interferometry (ESPI)

Research output: Chapter in Book/Report/Conference proceeding › Conference Contribution (Conference Proceeding)

Translated title of the contribution	Investigation of through-thickness displacement fields by electronic speckle pattern interferometry (ESPI)
Original language	English
Title of host publication	International Conference on Composites Testing and Model Identification Chalons-en-Champagne, France
Publication status	Published - Jan 2003

Handle.net

@inproceedings{ba40a6d6513c442b8a95eda022020bf3,

title = "Investigation of through-thickness displacement fields by electronic speckle pattern interferometry (ESPI)",

author = "AR Rashid and MR Wisnom and KD Potter and R Burguete and N Gauge",

year = "2003",

month = jan,

language = "English",

booktitle = "International Conference on Composites Testing and Model Identification Chalons-en-Champagne, France",

}

Investigation of through-thickness displacement fields by electronic speckle pattern interferometry (ESPI). / Rashid, AR; Wisnom, MR; Potter, KD et al.
International Conference on Composites Testing and Model Identification Chalons-en-Champagne, France. 2003.

Research output: Chapter in Book/Report/Conference proceeding › Conference Contribution (Conference Proceeding)

TY - GEN

T1 - Investigation of through-thickness displacement fields by electronic speckle pattern interferometry (ESPI)

AU - Rashid, AR

AU - Wisnom, MR

AU - Potter, KD

AU - Burguete, R

AU - Gauge, N

PY - 2003/1

Y1 - 2003/1

M3 - Conference Contribution (Conference Proceeding)

BT - International Conference on Composites Testing and Model Identification Chalons-en-Champagne, France

ER -