Investigation of various envelope complexity linearity under modulated stimulus using a new envelope formulation approach

F. L. Ogboi; P. J. Tasker; M. Akmal; J. Lees; J. Benedikt; S. Bensmida; K. Morris; M. Beach; J. McGeehan

doi:10.1109/CSICS.2014.6978563

Investigation of various envelope complexity linearity under modulated stimulus using a new envelope formulation approach

F. L. Ogboi, P. J. Tasker, M. Akmal, J. Lees, J. Benedikt, S. Bensmida, K. Morris, M. Beach, J. McGeehan

Research output: Chapter in Book/Report/Conference proceeding › Conference Contribution (Conference Proceeding)

1 Citation (Scopus)

Abstract

In [1] a new formulation for quantifying the linearizing baseband voltage signal, injected at the output bias port, to linearize a device behaviour was introduced. A key feature of this approach is that since it is formulated in the envelope domain the number of linearization coefficient required is independent of the envelope shape, complexity. This property is validated by performing baseband linearization investigations on a 10W Cree GaN HEMT device. Modulated signals with increasing complexity 3, 5, and 9-tone modulated stimulus, at 1.5dB of compression, were utilized. In all cases just two-linearization coefficients needed to be determined in order to compute the output baseband signal envelope necessary. Intermodulation distortion was reduced to around -50dBc, a value very close to the dynamic range limit of the measurement system.

Original language	English
Title of host publication	Technical Digest - IEEE Compound Semiconductor Integrated Circuit Symposium, CSIC
Publisher	Institute of Electrical and Electronics Engineers (IEEE)
ISBN (Print)	9781479936229
DOIs	https://doi.org/10.1109/CSICS.2014.6978563
Publication status	Published - 5 Dec 2014
Event	36th IEEE Compound Semiconductor Integrated Circuit Symposium, CSICS 2014 - San Diego, United States Duration: 19 Oct 2014 → 22 Oct 2014

Conference

Conference	36th IEEE Compound Semiconductor Integrated Circuit Symposium, CSICS 2014
Country/Territory	United States
City	San Diego
Period	19/10/14 → 22/10/14

Keywords

Distortion
Envelope
Modulation
Power amplifiers
Waveform engineering

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Ogboi, F. L., Tasker, P. J., Akmal, M., Lees, J., Benedikt, J., Bensmida, S., Morris, K., Beach, M., & McGeehan, J. (2014). Investigation of various envelope complexity linearity under modulated stimulus using a new envelope formulation approach. In Technical Digest - IEEE Compound Semiconductor Integrated Circuit Symposium, CSIC Article 6978563 Institute of Electrical and Electronics Engineers (IEEE). https://doi.org/10.1109/CSICS.2014.6978563

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abstract = "In [1] a new formulation for quantifying the linearizing baseband voltage signal, injected at the output bias port, to linearize a device behaviour was introduced. A key feature of this approach is that since it is formulated in the envelope domain the number of linearization coefficient required is independent of the envelope shape, complexity. This property is validated by performing baseband linearization investigations on a 10W Cree GaN HEMT device. Modulated signals with increasing complexity 3, 5, and 9-tone modulated stimulus, at 1.5dB of compression, were utilized. In all cases just two-linearization coefficients needed to be determined in order to compute the output baseband signal envelope necessary. Intermodulation distortion was reduced to around -50dBc, a value very close to the dynamic range limit of the measurement system.",

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author = "Ogboi, {F. L.} and Tasker, {P. J.} and M. Akmal and J. Lees and J. Benedikt and S. Bensmida and K. Morris and M. Beach and J. McGeehan",

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Ogboi, FL, Tasker, PJ, Akmal, M, Lees, J, Benedikt, J, Bensmida, S, Morris, K, Beach, M & McGeehan, J 2014, Investigation of various envelope complexity linearity under modulated stimulus using a new envelope formulation approach. in Technical Digest - IEEE Compound Semiconductor Integrated Circuit Symposium, CSIC., 6978563, Institute of Electrical and Electronics Engineers (IEEE), 36th IEEE Compound Semiconductor Integrated Circuit Symposium, CSICS 2014, San Diego, United States, 19/10/14. https://doi.org/10.1109/CSICS.2014.6978563

Investigation of various envelope complexity linearity under modulated stimulus using a new envelope formulation approach. / Ogboi, F. L.; Tasker, P. J.; Akmal, M. et al.
Technical Digest - IEEE Compound Semiconductor Integrated Circuit Symposium, CSIC. Institute of Electrical and Electronics Engineers (IEEE), 2014. 6978563.

Research output: Chapter in Book/Report/Conference proceeding › Conference Contribution (Conference Proceeding)

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T1 - Investigation of various envelope complexity linearity under modulated stimulus using a new envelope formulation approach

AU - Ogboi, F. L.

AU - Tasker, P. J.

AU - Akmal, M.

AU - Lees, J.

AU - Benedikt, J.

AU - Bensmida, S.

AU - Morris, K.

AU - Beach, M.

AU - McGeehan, J.

PY - 2014/12/5

Y1 - 2014/12/5

N2 - In [1] a new formulation for quantifying the linearizing baseband voltage signal, injected at the output bias port, to linearize a device behaviour was introduced. A key feature of this approach is that since it is formulated in the envelope domain the number of linearization coefficient required is independent of the envelope shape, complexity. This property is validated by performing baseband linearization investigations on a 10W Cree GaN HEMT device. Modulated signals with increasing complexity 3, 5, and 9-tone modulated stimulus, at 1.5dB of compression, were utilized. In all cases just two-linearization coefficients needed to be determined in order to compute the output baseband signal envelope necessary. Intermodulation distortion was reduced to around -50dBc, a value very close to the dynamic range limit of the measurement system.

AB - In [1] a new formulation for quantifying the linearizing baseband voltage signal, injected at the output bias port, to linearize a device behaviour was introduced. A key feature of this approach is that since it is formulated in the envelope domain the number of linearization coefficient required is independent of the envelope shape, complexity. This property is validated by performing baseband linearization investigations on a 10W Cree GaN HEMT device. Modulated signals with increasing complexity 3, 5, and 9-tone modulated stimulus, at 1.5dB of compression, were utilized. In all cases just two-linearization coefficients needed to be determined in order to compute the output baseband signal envelope necessary. Intermodulation distortion was reduced to around -50dBc, a value very close to the dynamic range limit of the measurement system.

KW - Distortion

KW - Envelope

KW - Modulation

KW - Power amplifiers

KW - Waveform engineering

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BT - Technical Digest - IEEE Compound Semiconductor Integrated Circuit Symposium, CSIC

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Ogboi FL, Tasker PJ, Akmal M, Lees J, Benedikt J, Bensmida S et al. Investigation of various envelope complexity linearity under modulated stimulus using a new envelope formulation approach. In Technical Digest - IEEE Compound Semiconductor Integrated Circuit Symposium, CSIC. Institute of Electrical and Electronics Engineers (IEEE). 2014. 6978563 doi: 10.1109/CSICS.2014.6978563

Investigation of various envelope complexity linearity under modulated stimulus using a new envelope formulation approach

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