Abstract
A two-terminal device can be incorporated into FDTD using the Lumped Element FDTD (LE-FDTD) formulation, unfortunately, this method is not able to analyze accurately the packaging effects of the device. This is possible using Lumped Network FDTD (LN-FDTD) - however LN-FDTD requires a complicated pre-calculation for simple devices such as Schottky or varactor diode. Therefore, this paper presents a simple and effective state space approach to incorporate device packaging effects into FDTD algorithm. The new technique is validated by means of experimental measurements of a varactor-tuned patch antenna and the agreement between the predicted and actual responses is shown to be excellent
| Translated title of the contribution | Lumped device modeling with FDTD including packaging effects |
|---|---|
| Original language | English |
| Title of host publication | IEEE MTT-S International : Microwave Symposium, 2002 |
| Publisher | Institute of Electrical and Electronics Engineers (IEEE) |
| Pages | 1139 - 1142 |
| Number of pages | 4 |
| Volume | 2 |
| ISBN (Print) | 0780372395 |
| DOIs | |
| Publication status | Published - Jun 2002 |
| Event | IEEE MTT-S International Microwave Symposium - Seattle, United States Duration: 1 Jun 2002 → … |
Conference
| Conference | IEEE MTT-S International Microwave Symposium |
|---|---|
| Country | United States |
| City | Seattle |
| Period | 1/06/02 → … |
Bibliographical note
Name and Venue of Event: Seattle, USAConference Proceedings/Title of Journal: IEEE MTT-S International : Microwave Symposium, 2002
Rose publication type: Conference contribution
Sponsorship: The authors wish to thank Professors Bull and
McGeehan for provision of facilities at Bristol and EPSRC for sponsoring this work
Terms of use: Copyright © 2002 IEEE. Reprinted from IEEE MTT-S International Microwave Symposium, 2002.
This material is posted here with permission of the IEEE. Such permission of the IEEE does not in any way imply IEEE endorsement of any of the University of Bristol's products or services. Internal or personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution must be obtained from the IEEE by writing to pubs-permissions@ieee.org.
By choosing to view this document, you agree to all provisions of the copyright laws protecting it.