Abstract
This paper summarizes the main results and contributions of the MagNet Challenge 2023, an open-source research initiative for data-driven modeling of power magnetic materials. The MagNet Challenge has (1) advanced the stateof-the-art in power magnetics modeling; (2) set up examples for fostering an open-source and transparent research community; (3) developed useful guidelines and practical rules for conducting data-driven research in power electronics; and (4) provided a fair performance benchmark leading to insights on the most promising future research directions. The competition yielded a collection of publicly disclosed software algorithms and tools designed to capture the distinct loss characteristics of power magnetic materials, which are mostly open-sourced. We have attempted to bridge power electronics domain knowledge with state-of-the-art advancements in artificial intelligence, machine learning, pattern recognition, and signal processing. The MagNet Challenge has greatly improved the accuracy and reduced the size of data-driven power magnetic material models. The models and tools created for various materials were meticulously documented and shared within the broader power electronics community.
Original language | English |
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Journal | IEEE Open Journal of Power Electronics |
DOIs | |
Publication status | Published - 30 Sept 2024 |
Bibliographical note
Publisher Copyright:© 2024 Institute of Electrical and Electronics Engineers Inc.. All rights reserved.
Keywords
- open source
- data-driven methods
- machine learning
- artificial intelligence
- power magnetics
- power ferrites
Fingerprint
Dive into the research topics of 'MagNet Challenge for Data-Driven Power Magnetics Modeling'. Together they form a unique fingerprint.Prizes
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EPSRC Impact Acceleration Account - Exploratory Award
Wang, J. (Recipient), 2022
Prize: Prizes, Medals, Awards and Grants
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Outstanding Performance Award 3rd Place, MagNet Challenge 2023
Wang, J. (Recipient), McKeague, T. (Recipient), Zhang, L. (Recipient), Cui, B. (Recipient) & Liu, S. (Recipient), 28 Feb 2024
Prize: Prizes, Medals, Awards and Grants
Equipment
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HPC (High Performance Computing) and HTC (High Throughput Computing) Facilities
Alam, S. R. (Manager), Williams, D. A. G. (Manager), Eccleston, P. E. (Manager) & Greene, D. (Manager)
Facility/equipment: Facility