Magnetic interactions in Ni-Cu/Cu superlattice nanowire arrays

AP Robinson, W Schwarzacher

Research output: Contribution to journalArticle (Academic Journal)peer-review

19 Citations (Scopus)

Abstract

The remanent magnetization of Ni-Cu/Cu superlattice nanowires was investigated. Arrays of superlattice nanowires were prepared by template deposition through polycarbonate nanoporous membranes using a single electrolyte bath. The thicknesses of the nickel-rich layers (t(Ni)) and copper layers (t(Cu)) were independently controlled by monitoring the current during deposition. The wire diameter was determined by transmission electron microscopy imaging to be 80 nm. A study of the remanent magnetization at 20 K for a range of values of t(Ni) and t(Cu) reveals the existence of magnetic interactions within each array. It is noted that for an array with t(Ni) of 200 A, the strength of the interactions decreases with increasing t(Cu), indicating that the interactions are taking place between nickel layers. However the interaction strength appears to reach a minimum level, beyond which an increase in t(Cu) does not correspond to a decrease in the interaction strength observed. A minimum interaction level is also observed for an array with t(Ni) of 50 A, for all values of t(Cu) investigated.
Translated title of the contributionMagnetic interactions in Ni-Cu/Cu superlattice nanowire arrays
Original languageEnglish
Pages (from-to)7250 - 7251
Number of pages2
JournalJournal of Applied Physics
Volume93 (10)
Publication statusPublished - 2003

Bibliographical note

Publisher: American Institute of Physics

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