Abstract
The remanent magnetization of Ni-Cu/Cu superlattice nanowires was investigated. Arrays of superlattice nanowires were prepared by template deposition through polycarbonate nanoporous membranes using a single electrolyte bath. The thicknesses of the nickel-rich layers (t(Ni)) and copper layers (t(Cu)) were independently controlled by monitoring the current during deposition. The wire diameter was determined by transmission electron microscopy imaging to be 80 nm. A study of the remanent magnetization at 20 K for a range of values of t(Ni) and t(Cu) reveals the existence of magnetic interactions within each array. It is noted that for an array with t(Ni) of 200 A, the strength of the interactions decreases with increasing t(Cu), indicating that the interactions are taking place between nickel layers. However the interaction strength appears to reach a minimum level, beyond which an increase in t(Cu) does not correspond to a decrease in the interaction strength observed. A minimum interaction level is also observed for an array with t(Ni) of 50 A, for all values of t(Cu) investigated.
Translated title of the contribution | Magnetic interactions in Ni-Cu/Cu superlattice nanowire arrays |
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Original language | English |
Pages (from-to) | 7250 - 7251 |
Number of pages | 2 |
Journal | Journal of Applied Physics |
Volume | 93 (10) |
Publication status | Published - 2003 |