Proposes a global solution for the low-cost integration of a whole 60-80 GHz system including antenna arrays in MCM-L/D technology. The performance and feasibility of integrated slot and patch antennas for high directivity demanding applications is demonstrated, pointing at the microstrip patch array as a simpler solution. Both microstrip and CPW approach for the realisation of transmission media and distributed passives have also been analysed. The high performance of this solution has been demonstrated based on some examples such as: Wilkinson divider, branch-line coupler, a rat-race and a 4th order band-pass filter. Both microstrip and CPW resistors have been evaluated and parasitic effect compensating techniques have been proposed. The performance of via-based loads in microstrip configuration differs slightly from their via-less CPW counterparts. The ultimate MCM-D/L mixed solution with the appropriate BCB and laminate thicknesses has been proposed, which allows integration of high-performance interconnections, distributed passives; and flat high-efficiency patch antenna arrays.
|Translated title of the contribution||MCM-D technology for realisation of low cost system-on-package concept at 60-80 GHz|
|Title of host publication||Electrical Performance of Electronic Packaging 2002 (EPEP 2002), Monterey, California|
|Publisher||Institute of Electrical and Electronics Engineers (IEEE)|
|Pages||55 - 58|
|Number of pages||4|
|Publication status||Published - 21 Oct 2002|
Grzyb, J., Ruiz, I., Klemm, M., & Troster, G. (2002). MCM-D technology for realisation of low cost system-on-package concept at 60-80 GHz. In Electrical Performance of Electronic Packaging 2002 (EPEP 2002), Monterey, California (pp. 55 - 58). Institute of Electrical and Electronics Engineers (IEEE). https://doi.org/10.1109/EPEP.2002.1057882