Abstract
The design optimization of high-density power electronics systems requires fast and accurate thermal analysis methods that can reflect the geometry and layout variations as part of the virtual prototyping process. Mesh-based lumped parameter model (MLPM), which is formed based on analytical solutions, has been investigated in this paper as an effective numerical method for thermal analysis. By comparing to the commonly-used finite difference method (FDM), the MLPM proves to be more accurate with the same mesh size in both steady and transient states. Therefore, MLPM is faster than FDM to achieve the same accuracy and needs less computational resources. In addition, model order reduction (MOR) has been successfully applied to MLPM in this paper to further accelerate the computation speed in the transient state analysis. A one-dimensional bar and a multilevel converter power module have been used as examples to validate the effectiveness of the MLPM.
| Original language | English |
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| Title of host publication | 2017 IEEE 3rd International Future Energy Electronics Conference and ECCE Asia (IFEEC 2017 - ECCE Asia) |
| Publisher | Institute of Electrical and Electronics Engineers (IEEE) |
| Pages | 1037-1042 |
| Number of pages | 6 |
| ISBN (Electronic) | 978-1-5090-5157-1 |
| ISBN (Print) | 978-1-5090-5158-8 |
| DOIs | |
| Publication status | Published - 2017 |