Metal deposition via electroless surface limited redox replacement

S. Ambrozik, B. Rawlings, N. Vasiljevic, N. Dimitrov*

*Corresponding author for this work

Research output: Contribution to journalArticle (Academic Journal)peer-review

17 Citations (Scopus)

Abstract

The development of electroless SLRR (ESLRR) utilizing a galvanic cell configuration is demonstrated at a proof-of concept level by the deposition of epitaxial Ag layers on Au. ESLRR is realized via the connection and subsequent disconnection of an Au working electrode (WE) to a Pb "executive" electrode (EE). The connection leads to the underpotential deposition of a Pb monolayer at the WE driven by the stripping of an equivalent amount of Pb from the EE. The disconnection then enables the galvanic displacement of the Pb monolayer by Ag. Electrochemical and in-situ STM characterizations of deposited Ag films show high-quality 2D-growth with no roughness development for up to 50 ESLRR cycles. This approach can be extended to a variety of metal-substrate pairs widely applicable in electrocatalysis and energy applications. (C) 2014 Elsevier B.V. All rights reserved.

Original languageEnglish
Pages (from-to)19-22
Number of pages4
JournalElectrochemistry communications
Volume44
DOIs
Publication statusPublished - Jul 2014

Keywords

  • Electroless SLRR
  • Deposition
  • Thin films
  • Galvanic couple
  • Catalysis
  • ONE-CELL CONFIGURATION
  • EPITAXIAL-GROWTH
  • OXYGEN REDUCTION
  • AU(111)
  • LAYER
  • UPD
  • PB
  • ADLAYERS
  • AU(100)
  • FILMS

Cite this