Monitoring Cu nodule formation using Ni marker layers

M. Lafouresse; Y. Fukunaka; T. Matsuoka; W Schwarzacher

doi:10.1016/j.electacta.2011.02.040

Monitoring Cu nodule formation using Ni marker layers

M. Lafouresse, Y. Fukunaka, T. Matsuoka, W Schwarzacher

School of Physics

Research output: Contribution to journal › Article (Academic Journal) › peer-review

1 Citation (Scopus)

Translated title of the contribution	Monitoring Cu nodule formation using Ni marker layers
Original language	English
Pages (from-to)	4457 - 4461
Number of pages	5
Journal	Electrochimica Acta
Volume	56
Issue number	12
DOIs	https://doi.org/10.1016/j.electacta.2011.02.040
Publication status	Published - Apr 2011

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10.1016/j.electacta.2011.02.040

http://www.sciencedirect.com/science/article/pii/S0013468611002556

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KINETIC ROUGHENING OF ELECTRODEPOSITED THIN FILMS
Schwarzacher, W.
1/11/03 → 1/11/06
Project: Research

Cite this

@article{b1451b907bf04b70ae74ba87a980da5a,

title = "Monitoring Cu nodule formation using Ni marker layers",

author = "M. Lafouresse and Y. Fukunaka and T. Matsuoka and W Schwarzacher",

year = "2011",

month = apr,

doi = "10.1016/j.electacta.2011.02.040",

language = "English",

volume = "56",

pages = "4457 -- 4461",

journal = "Electrochimica Acta",

issn = "0013-4686",

publisher = "Elsevier Limited",

number = "12",

}

TY - JOUR

T1 - Monitoring Cu nodule formation using Ni marker layers

AU - Lafouresse, M.

AU - Fukunaka, Y.

AU - Matsuoka, T.

AU - Schwarzacher, W

PY - 2011/4

Y1 - 2011/4

U2 - 10.1016/j.electacta.2011.02.040

DO - 10.1016/j.electacta.2011.02.040

M3 - Article (Academic Journal)

SN - 0013-4686

VL - 56

SP - 4457

EP - 4461

JO - Electrochimica Acta

JF - Electrochimica Acta

IS - 12

ER -

Monitoring Cu nodule formation using Ni marker layers

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KINETIC ROUGHENING OF ELECTRODEPOSITED THIN FILMS

Cite this