@inproceedings{f40792547b754f488c1addd203aa816c,
title = "Multi-cell soft errors at the 16-nm FinFET technology node",
abstract = "Soft error performance of 16-nm FinFET SRAM designs fabricated using a commercial bulk CMOS process is evaluated using heavy-ions. Results included supply voltage variations show that multi-cell upsets dominate soft-error rates. Dual-port SRAM has higher cross-section than single-port SRAM but did not have any multi-cell upset across the bit-line direction. TCAD simulations showing the extent of the perturbation in the electric parameters as a function of particle LET support the experimental data.",
keywords = "FinFET technology, multi-bit upsets, scaling, soft errors, SRAM, TCAD modeling",
author = "N. Tam and Bhuva, {B. L.} and Massengill, {L. W.} and D. Ball and M. McCurdy and Alles, {M. L.} and I. Chatterjee",
year = "2015",
month = may,
day = "26",
doi = "10.1109/IRPS.2015.7112730",
language = "English",
isbn = "9781467373623",
volume = "2015-May",
series = "International Reliability Physics Symposium",
publisher = "Institute of Electrical and Electronics Engineers (IEEE)",
pages = "4B31--4B35",
booktitle = "IEEE International Reliability Physics Symposium Proceedings",
address = "United States",
note = "IEEE International Reliability Physics Symposium, IRPS 2015 ; Conference date: 19-04-2015 Through 23-04-2015",
}