Novel Thermal Management of GaN Electronics: Diamond Substrates

Martin Kuball, James W. Pomeroy, Julian Anaya Calvo, Huarui Sun, Roland B. Simon, Daniel Francis, Firooz Faili, Daniel Twitchen, Stefano Rossi, Mohammed Alomari, Erhard Kohn, Lajos Tóth, Béla Pécz

Research output: Chapter in Book/Report/Conference proceedingConference Contribution (Conference Proceeding)

4 Citations (Scopus)
348 Downloads (Pure)

Abstract

Microwave and power electronics based on GaN enables the performance of systems and their safe operating area to be driven to 'extremes'. One of the major issues that then arises is thermal management. This includes heat transfer limitations across interfaces, however also the need of incorporating novel high thermal conductivity materials such as diamond. Thermal parameters of these novel device systems and their implications on the near junction temperature in the devices are not well known. The role of interfaces between the GaN transistor and the diamond substrate, and of the diamond thermal properties themselves near this interface are discussed, and novel thermal characterization approaches, such as enabling fast determination of the thermal resistance on the wafer level, as well as of lateral diamond thermal conductivity, are presented.

Original languageEnglish
Title of host publicationASME 2015 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems collocated with the ASME 2015 13th International Conference on Nanochannels, Microchannels, and Minichannels
Subtitle of host publicationAdvanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays
PublisherAmerican Society of Mechanical Engineers (ASME)
Number of pages5
Volume3
ISBN (Print)9780791856901
DOIs
Publication statusPublished - 9 Jul 2015
EventASME 2015 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2015, collocated with the ASME 2015 13th International Conference on Nanochannels, Microchannels, and Minichannels - San Francisco, United States
Duration: 6 Jul 20159 Jul 2015

Conference

ConferenceASME 2015 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2015, collocated with the ASME 2015 13th International Conference on Nanochannels, Microchannels, and Minichannels
CountryUnited States
CitySan Francisco
Period6/07/159/07/15

Structured keywords

  • CDTR

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