On Signalling over Through-Silicon Via (TSV) Interconnects in 3-D Integrated Circuits

Roshan Weerasekera, Matt Grange, Dinesh Pamunuwa, Hannu Tenhunen

Research output: Chapter in Book/Report/Conference proceedingConference Contribution (Conference Proceeding)

22 Citations (Scopus)

Abstract

This paper discusses signal integrity (SI) issues and signalling techniques for Through Silicon Via (TSV) interconnects in 3-D Integrated Circuits (ICs). Field-solver extracted parasitics of TSVs have been employed in Spice simulations to investigate the effect of each parasitic component on performance metrics such as delay and crosstalk and identify a reduced-order electrical model that captures all relevant effects. We show that in dense TSV structures voltage-mode (VM) signalling does not lend itself to achieving high data-rates, and that current-mode (CM) signalling is more effective for high throughput signalling as well as jitter reduction. Data rates, energy consumption and coupled noise for the different signalling modes are extracted.
Original languageUndefined/Unknown
Title of host publicationProc. Conference on Design, Automation and Test in Europe
Pages1325-1328
Number of pages4
DOIs
Publication statusPublished - 1 Mar 2010

Keywords

  • SPICE
  • crosstalk
  • integrated circuit interconnections
  • 3D integrated circuits
  • Spice simulations
  • current-mode signalling
  • jitter reduction
  • reduced-order electrical model
  • signal integrity
  • through-silicon via interconnects
  • voltage-mode signalling
  • Circuit simulation
  • Crosstalk
  • Delay effects
  • Integrated circuit interconnections
  • Measurement
  • Silicon
  • Three-dimensional integrated circuits
  • Through-silicon vias
  • Virtual manufacturing
  • Voltage

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