On the single-chip implementation of a Hiperlan/2 and IEEE 802.11a capable modem

E Grass; K Tittelbach; U Jagdhold; G Troya; O Krueger; J Lehmann; K Maharatna; N Fiebig; K Dombrowski; R Kraemer; P Maehoenen

doi:10.1109/98.972168

On the single-chip implementation of a Hiperlan/2 and IEEE 802.11a capable modem

E Grass, K Tittelbach, U Jagdhold, G Troya, O Krueger, J Lehmann, K Maharatna, N Fiebig, K Dombrowski, R Kraemer, P Maehoenen

University of Bristol

Research output: Contribution to journal › Article (Academic Journal) › peer-review

50 Citations (Scopus)

Abstract

Broadband wireless communication is the key technology to a new generation of products in the consumer market. The emerging standards for the 5 GHz band will form the basis for many applications requiring a high communication bandwidth. Low cost and low power dissipation will be a prerequisite for most mobile applications. One way to realize low-cost systems is to reduce the system complexity and deploy highly integrated components. The work presented in this article discusses aspects of implementing a complete Hiperlan/2 and IEEE 802.11a compliant modem, including the physical layer as well as the data link control layer, into a single chip

Translated title of the contribution	On the single-chip implementation of a Hiperlan/2 and IEEE 802.11a capable modem
Original language	English
Article number	No. 6
Pages (from-to)	48 - 57
Number of pages	10
Journal	IEEE Personal Communications
Volume	8
DOIs	https://doi.org/10.1109/98.972168
Publication status	Published - Dec 2001

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Publisher: IEEE

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http://ieeexplore.ieee.org/search/srchabstract.jsp?arnumber=972168&isnumber=20958&punumber=98&k2dockey=972168@ieeejrns&query=%28+maharatna%3Cin%3Emetadata+%29&pos=1

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title = "On the single-chip implementation of a Hiperlan/2 and IEEE 802.11a capable modem",

abstract = "Broadband wireless communication is the key technology to a new generation of products in the consumer market. The emerging standards for the 5 GHz band will form the basis for many applications requiring a high communication bandwidth. Low cost and low power dissipation will be a prerequisite for most mobile applications. One way to realize low-cost systems is to reduce the system complexity and deploy highly integrated components. The work presented in this article discusses aspects of implementing a complete Hiperlan/2 and IEEE 802.11a compliant modem, including the physical layer as well as the data link control layer, into a single chip",

author = "E Grass and K Tittelbach and U Jagdhold and G Troya and O Krueger and J Lehmann and K Maharatna and N Fiebig and K Dombrowski and R Kraemer and P Maehoenen",

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year = "2001",

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doi = "10.1109/98.972168",

language = "English",

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TY - JOUR

T1 - On the single-chip implementation of a Hiperlan/2 and IEEE 802.11a capable modem

AU - Grass, E

AU - Tittelbach, K

AU - Jagdhold, U

AU - Troya, G

AU - Krueger, O

AU - Lehmann, J

AU - Maharatna, K

AU - Fiebig, N

AU - Dombrowski, K

AU - Kraemer, R

AU - Maehoenen, P

N1 - Publisher: IEEE

PY - 2001/12

Y1 - 2001/12

N2 - Broadband wireless communication is the key technology to a new generation of products in the consumer market. The emerging standards for the 5 GHz band will form the basis for many applications requiring a high communication bandwidth. Low cost and low power dissipation will be a prerequisite for most mobile applications. One way to realize low-cost systems is to reduce the system complexity and deploy highly integrated components. The work presented in this article discusses aspects of implementing a complete Hiperlan/2 and IEEE 802.11a compliant modem, including the physical layer as well as the data link control layer, into a single chip

AB - Broadband wireless communication is the key technology to a new generation of products in the consumer market. The emerging standards for the 5 GHz band will form the basis for many applications requiring a high communication bandwidth. Low cost and low power dissipation will be a prerequisite for most mobile applications. One way to realize low-cost systems is to reduce the system complexity and deploy highly integrated components. The work presented in this article discusses aspects of implementing a complete Hiperlan/2 and IEEE 802.11a compliant modem, including the physical layer as well as the data link control layer, into a single chip

U2 - 10.1109/98.972168

DO - 10.1109/98.972168

M3 - Article (Academic Journal)

VL - 8

SP - 48

EP - 57

JO - IEEE Personal Communications

JF - IEEE Personal Communications

M1 - No. 6

ER -

On the single-chip implementation of a Hiperlan/2 and IEEE 802.11a capable modem

Abstract

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