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Two distinct morphologies were observed for copper films electrodeposited from an organic additive-free acid sulphate electrolyte near the limiting current density, namely facetted columns and spheroidal nodules. Facetted columns form for overpotentials eta = 200-280 mV while nodules form for eta > 240 mV. Electron Back Scattering Diffraction (EBSD) was applied to cross-sections of the columnar films to determine the crystallographic orientation of individual grains. Over the first few microns, the substrate has a strong influence, but for greater thicknesses, the columnar film develops a strong < 110 > and weak < 112 > fibre texture. (C) 2011 The Electrochemical Society. [DOI: 10.1149/1.3578016] All rights reserved.