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Printegrated Circuits: Personal Fabrication of 3D Printed Devices with Embedded PCBs

Oliver Child, Ollie Hanton, Jack Dawson, Steve Hodges, Mike Fraser

Research output: Chapter in Book/Report/Conference proceedingConference Contribution (Conference Proceeding)

Abstract

Consumer-level multi-material 3D printing with conductive thermoplastics enables fabrication of interactive elements for bespoke tangible devices. However, large feature sizes, high resistance materials, and limitations of printable control circuitry mean that deployable devices cannot be printed without post-print assembly steps. To address these challenges, we present Printegrated Circuits, a technique that uses traditional electronics as material to 3D print self-contained interactive objects. Embedded PCBs are placed into recesses during a pause in the print, and through a process we term Prinjection, conductive filament is injected into their plated-through holes. This automatically creates reliable electrical and mechanical contact, eliminating the need for manual wiring or bespoke connectors. We describe the custom machine code generation that supports our approach, and characterise its electrical and mechanical properties. With our 6 demonstrations, we highlight how the Printegrated Circuits process fits into existing design and prototyping workflows as well as informs future research agendas.
Original languageEnglish
Title of host publicationTEI '26
Subtitle of host publicationProceedings of the Twentieth International Conference on Tangible, Embedded, and Embodied Interaction
PublisherAssociation for Computing Machinery
Number of pages19
ISBN (Electronic)9798400718687
DOIs
Publication statusPublished - 7 Mar 2026
EventTwentieth International Conference on Tangible, Embedded, and Embodied Interaction - Chicago, United States
Duration: 8 Mar 202611 Mar 2026
Conference number: 20th
https://web.cvent.com/event/2834a3b4-5b70-46e0-b375-4f4a89dabfd4/summary

Publication series

NameProceedings of 20th International Conference on Tangible, Embedded, and Embodied Interaction
PublisherACM

Conference

ConferenceTwentieth International Conference on Tangible, Embedded, and Embodied Interaction
Abbreviated titleTEI 2026
Country/TerritoryUnited States
CityChicago
Period8/03/2611/03/26
Internet address

Bibliographical note

Publisher Copyright:
© 2026 Copyright held by the owner/author(s).

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