Abstract
Consumer-level multi-material 3D printing with conductive thermoplastics enables fabrication of interactive elements for bespoke tangible devices. However, large feature sizes, high resistance materials, and limitations of printable control circuitry mean that deployable devices cannot be printed without post-print assembly steps. To address these challenges, we present Printegrated Circuits, a technique that uses traditional electronics as material to 3D print self-contained interactive objects. Embedded PCBs are placed into recesses during a pause in the print, and through a process we term Prinjection, conductive filament is injected into their plated-through holes. This automatically creates reliable electrical and mechanical contact, eliminating the need for manual wiring or bespoke connectors. We describe the custom machine code generation that supports our approach, and characterise its electrical and mechanical properties. With our 6 demonstrations, we highlight how the Printegrated Circuits process fits into existing design and prototyping workflows as well as informs future research agendas.
| Original language | English |
|---|---|
| Title of host publication | TEI '26 |
| Subtitle of host publication | Proceedings of the Twentieth International Conference on Tangible, Embedded, and Embodied Interaction |
| Publisher | Association for Computing Machinery |
| Number of pages | 19 |
| ISBN (Electronic) | 9798400718687 |
| DOIs | |
| Publication status | Published - 7 Mar 2026 |
| Event | Twentieth International Conference on Tangible, Embedded, and Embodied Interaction - Chicago, United States Duration: 8 Mar 2026 → 11 Mar 2026 Conference number: 20th https://web.cvent.com/event/2834a3b4-5b70-46e0-b375-4f4a89dabfd4/summary |
Publication series
| Name | Proceedings of 20th International Conference on Tangible, Embedded, and Embodied Interaction |
|---|---|
| Publisher | ACM |
Conference
| Conference | Twentieth International Conference on Tangible, Embedded, and Embodied Interaction |
|---|---|
| Abbreviated title | TEI 2026 |
| Country/Territory | United States |
| City | Chicago |
| Period | 8/03/26 → 11/03/26 |
| Internet address |
Bibliographical note
Publisher Copyright:© 2026 Copyright held by the owner/author(s).
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