Propagation and bit error rate measurements within buildings in the millimetre wave band about 60 GHz

AR Tharek, JP McGeehan

Research output: Chapter in Book/Report/Conference proceedingConference Contribution (Conference Proceeding)

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Abstract

There is a significant interest in the millimetric waveband around 60 GHz for providing integrated personal communications for a wide range of digital services to mobile users and data terminals. Furthermore, with recent advances in GaAs technology, the use of 60 GHz in broadband short-range point-to-point links is also the subject of much investigation at the moment. A study of propagation and bit error rate within buildings using phase-locked oscillators at 60 GHz is reported. The measurements include envelope distribution, median received signal power versus distance, signal coverage, knife edge diffraction, and bit error rate using frequency-shift keying
Translated title of the contributionPropagation and bit error rate measurements within buildings in the millimeter wave band about 60 GHz
Original languageEnglish
Title of host publication8th European Conference on Area Communication (EUROCON 88), Stockholm
PublisherInstitute of Electrical and Electronics Engineers (IEEE)
Pages318 - 321
Number of pages4
DOIs
Publication statusPublished - Jun 1988
Event8th European Conference on Electrotechnics (EUROCON 88) - Stockholm, Sweden
Duration: 1 Jun 1988 → …

Conference

Conference8th European Conference on Electrotechnics (EUROCON 88)
CountrySweden
CityStockholm
Period1/06/88 → …

Bibliographical note

Rose publication type: Conference contribution

Sponsorship: One of the authors, A.R. Tharek, would like to thank the University of Technology Malaysia and the Malaysian Government for their financial support

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Keywords

  • radiowave propagation
  • microwave links
  • 60 GHz

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    Tharek, AR., & McGeehan, JP. (1988). Propagation and bit error rate measurements within buildings in the millimetre wave band about 60 GHz. In 8th European Conference on Area Communication (EUROCON 88), Stockholm (pp. 318 - 321). Institute of Electrical and Electronics Engineers (IEEE). https://doi.org/10.1109/EURCON.1988.11166