Quasi-CPW lines on MCM-D for the realisation of via-less transmission elements and distributed passives

G Grzyb, I Ruiz, M Klemm, G Troster

Research output: Chapter in Book/Report/Conference proceedingConference Contribution (Conference Proceeding)

5 Citations (Scopus)

Abstract

This paper presents the 'quasi-CPW' and 'quasi-ACPS' transmission lines as the base elements for the via-less realisation of different transmission elements and distributed passives in low-cost MCM-D technology. This new approach simplifies the design, avoids via-processing problems and reduces the required computational resources in the design phase. Additionally, lower line characteristic impedances become achievable allowing the realisation of some distributed elements, which are not feasible in standard CPW configuration. The use of 'quasi-ACPS' lines in junctions avoids the slot-mode excitation. The presented investigations are within the framework of the European project LIPS (Low Cost Interconnect, Packaging and Subsystem Integration Technologies for Millimetre-Wave Applications).
Translated title of the contributionQuasi-CPW lines on MCM-D for the realisation of via-less transmission elements and distributed passives
Original languageEnglish
Title of host publicationElectrical Performance of Electronic Packaging 2002 (EPEP 2002), Monterey, USA
PublisherInstitute of Electrical and Electronics Engineers (IEEE)
Pages51 - 54
Number of pages4
ISBN (Print)0780374517
DOIs
Publication statusPublished - 21 Oct 2002

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