This paper presents the 'quasi-CPW' and 'quasi-ACPS' transmission lines as the base elements for the via-less realisation of different transmission elements and distributed passives in low-cost MCM-D technology. This new approach simplifies the design, avoids via-processing problems and reduces the required computational resources in the design phase. Additionally, lower line characteristic impedances become achievable allowing the realisation of some distributed elements, which are not feasible in standard CPW configuration. The use of 'quasi-ACPS' lines in junctions avoids the slot-mode excitation. The presented investigations are within the framework of the European project LIPS (Low Cost Interconnect, Packaging and Subsystem Integration Technologies for Millimetre-Wave Applications).
|Translated title of the contribution||Quasi-CPW lines on MCM-D for the realisation of via-less transmission elements and distributed passives|
|Title of host publication||Electrical Performance of Electronic Packaging 2002 (EPEP 2002), Monterey, USA|
|Publisher||Institute of Electrical and Electronics Engineers (IEEE)|
|Pages||51 - 54|
|Number of pages||4|
|Publication status||Published - 21 Oct 2002|