Quasi-CPW lines on MCM-D for the realisation of via-less transmission elements and distributed passives

G Grzyb; I Ruiz; M Klemm; G Troster

doi:10.1109/EPEP.2002.1057881

Quasi-CPW lines on MCM-D for the realisation of via-less transmission elements and distributed passives

G Grzyb, I Ruiz, M Klemm, G Troster

Research output: Chapter in Book/Report/Conference proceeding › Conference Contribution (Conference Proceeding)

5 Citations (Scopus)

Abstract

This paper presents the 'quasi-CPW' and 'quasi-ACPS' transmission lines as the base elements for the via-less realisation of different transmission elements and distributed passives in low-cost MCM-D technology. This new approach simplifies the design, avoids via-processing problems and reduces the required computational resources in the design phase. Additionally, lower line characteristic impedances become achievable allowing the realisation of some distributed elements, which are not feasible in standard CPW configuration. The use of 'quasi-ACPS' lines in junctions avoids the slot-mode excitation. The presented investigations are within the framework of the European project LIPS (Low Cost Interconnect, Packaging and Subsystem Integration Technologies for Millimetre-Wave Applications).

Translated title of the contribution	Quasi-CPW lines on MCM-D for the realisation of via-less transmission elements and distributed passives
Original language	English
Title of host publication	Electrical Performance of Electronic Packaging 2002 (EPEP 2002), Monterey, USA
Publisher	Institute of Electrical and Electronics Engineers (IEEE)
Pages	51 - 54
Number of pages	4
ISBN (Print)	0780374517
DOIs	https://doi.org/10.1109/EPEP.2002.1057881
Publication status	Published - 21 Oct 2002

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@inproceedings{a6497f417241453ea9726394c4330e8b,

title = "Quasi-CPW lines on MCM-D for the realisation of via-less transmission elements and distributed passives",

abstract = "This paper presents the 'quasi-CPW' and 'quasi-ACPS' transmission lines as the base elements for the via-less realisation of different transmission elements and distributed passives in low-cost MCM-D technology. This new approach simplifies the design, avoids via-processing problems and reduces the required computational resources in the design phase. Additionally, lower line characteristic impedances become achievable allowing the realisation of some distributed elements, which are not feasible in standard CPW configuration. The use of 'quasi-ACPS' lines in junctions avoids the slot-mode excitation. The presented investigations are within the framework of the European project LIPS (Low Cost Interconnect, Packaging and Subsystem Integration Technologies for Millimetre-Wave Applications).",

author = "G Grzyb and I Ruiz and M Klemm and G Troster",

year = "2002",

month = oct,

day = "21",

doi = "10.1109/EPEP.2002.1057881",

language = "English",

isbn = "0780374517",

pages = "51 -- 54",

booktitle = "Electrical Performance of Electronic Packaging 2002 (EPEP 2002), Monterey, USA",

publisher = "Institute of Electrical and Electronics Engineers (IEEE)",

address = "United States",

}

Quasi-CPW lines on MCM-D for the realisation of via-less transmission elements and distributed passives. / Grzyb, G; Ruiz, I; Klemm, M; Troster, G.

Electrical Performance of Electronic Packaging 2002 (EPEP 2002), Monterey, USA. Institute of Electrical and Electronics Engineers (IEEE), 2002. p. 51 - 54.

Research output: Chapter in Book/Report/Conference proceeding › Conference Contribution (Conference Proceeding)

TY - GEN

T1 - Quasi-CPW lines on MCM-D for the realisation of via-less transmission elements and distributed passives

AU - Grzyb, G

AU - Ruiz, I

AU - Klemm, M

AU - Troster, G

PY - 2002/10/21

Y1 - 2002/10/21

N2 - This paper presents the 'quasi-CPW' and 'quasi-ACPS' transmission lines as the base elements for the via-less realisation of different transmission elements and distributed passives in low-cost MCM-D technology. This new approach simplifies the design, avoids via-processing problems and reduces the required computational resources in the design phase. Additionally, lower line characteristic impedances become achievable allowing the realisation of some distributed elements, which are not feasible in standard CPW configuration. The use of 'quasi-ACPS' lines in junctions avoids the slot-mode excitation. The presented investigations are within the framework of the European project LIPS (Low Cost Interconnect, Packaging and Subsystem Integration Technologies for Millimetre-Wave Applications).

AB - This paper presents the 'quasi-CPW' and 'quasi-ACPS' transmission lines as the base elements for the via-less realisation of different transmission elements and distributed passives in low-cost MCM-D technology. This new approach simplifies the design, avoids via-processing problems and reduces the required computational resources in the design phase. Additionally, lower line characteristic impedances become achievable allowing the realisation of some distributed elements, which are not feasible in standard CPW configuration. The use of 'quasi-ACPS' lines in junctions avoids the slot-mode excitation. The presented investigations are within the framework of the European project LIPS (Low Cost Interconnect, Packaging and Subsystem Integration Technologies for Millimetre-Wave Applications).

U2 - 10.1109/EPEP.2002.1057881

DO - 10.1109/EPEP.2002.1057881

M3 - Conference Contribution (Conference Proceeding)

SN - 0780374517

SP - 51

EP - 54

BT - Electrical Performance of Electronic Packaging 2002 (EPEP 2002), Monterey, USA

PB - Institute of Electrical and Electronics Engineers (IEEE)

ER -