Residual stress measurement in thin films at sub-micron scale using Focused Ion Beam milling and imaging

Xu Song; Kong Boon Yeap; Jing Zhu; Jonathan Belnoue; Marco Sebastiani; Edoardo Bemporad; Kaiyang Zeng; Alexander M. Korsunsky

doi:10.1016/j.tsf.2011.10.211

Residual stress measurement in thin films at sub-micron scale using Focused Ion Beam milling and imaging

Xu Song, Kong Boon Yeap, Jing Zhu, Jonathan Belnoue, Marco Sebastiani, Edoardo Bemporad, Kaiyang Zeng, Alexander M. Korsunsky

Research output: Contribution to journal › Article (Academic Journal)

31 Citations (Scopus)

Abstract

Residual stress evaluation in thin films at the sub-micron scale was achieved in the present study using a semi-destructive trench-cutting (ring-core) method. Focused Ion Beam was employed to introduce the strain relief by milling the slots around an "island" and also to record the images for strain change evaluation by digital image correlation analysis of micrographs. Finite element simulation was employed to predict the curves for strain relief as a function of milling depth, and compared with the experimental measurements, showing good agreement. An empirical mathematical description of the curves was proposed that allows efficient data analysis for residual stress evaluation. (C) 2011 Elsevier B.V. All rights reserved.

Original language	English
Pages (from-to)	2073-2076
Number of pages	4
Journal	Thin Solid Films
Volume	520
Issue number	6
DOIs	https://doi.org/10.1016/j.tsf.2011.10.211
Publication status	Published - 1 Jan 2012

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10.1016/j.tsf.2011.10.211

Cite this

Song, X., Yeap, K. B., Zhu, J., Belnoue, J., Sebastiani, M., Bemporad, E., Zeng, K., & Korsunsky, A. M. (2012). Residual stress measurement in thin films at sub-micron scale using Focused Ion Beam milling and imaging. Thin Solid Films, 520(6), 2073-2076. https://doi.org/10.1016/j.tsf.2011.10.211

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abstract = "Residual stress evaluation in thin films at the sub-micron scale was achieved in the present study using a semi-destructive trench-cutting (ring-core) method. Focused Ion Beam was employed to introduce the strain relief by milling the slots around an {"}island{"} and also to record the images for strain change evaluation by digital image correlation analysis of micrographs. Finite element simulation was employed to predict the curves for strain relief as a function of milling depth, and compared with the experimental measurements, showing good agreement. An empirical mathematical description of the curves was proposed that allows efficient data analysis for residual stress evaluation. (C) 2011 Elsevier B.V. All rights reserved.",

author = "Xu Song and Yeap, {Kong Boon} and Jing Zhu and Jonathan Belnoue and Marco Sebastiani and Edoardo Bemporad and Kaiyang Zeng and Korsunsky, {Alexander M.}",

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Residual stress measurement in thin films at sub-micron scale using Focused Ion Beam milling and imaging. / Song, Xu; Yeap, Kong Boon; Zhu, Jing; Belnoue, Jonathan; Sebastiani, Marco; Bemporad, Edoardo; Zeng, Kaiyang; Korsunsky, Alexander M.

In: Thin Solid Films, Vol. 520, No. 6, 01.01.2012, p. 2073-2076.

Research output: Contribution to journal › Article (Academic Journal)

TY - JOUR

T1 - Residual stress measurement in thin films at sub-micron scale using Focused Ion Beam milling and imaging

AU - Song, Xu

AU - Yeap, Kong Boon

AU - Zhu, Jing

AU - Belnoue, Jonathan

AU - Sebastiani, Marco

AU - Bemporad, Edoardo

AU - Zeng, Kaiyang

AU - Korsunsky, Alexander M.

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AB - Residual stress evaluation in thin films at the sub-micron scale was achieved in the present study using a semi-destructive trench-cutting (ring-core) method. Focused Ion Beam was employed to introduce the strain relief by milling the slots around an "island" and also to record the images for strain change evaluation by digital image correlation analysis of micrographs. Finite element simulation was employed to predict the curves for strain relief as a function of milling depth, and compared with the experimental measurements, showing good agreement. An empirical mathematical description of the curves was proposed that allows efficient data analysis for residual stress evaluation. (C) 2011 Elsevier B.V. All rights reserved.

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DO - 10.1016/j.tsf.2011.10.211

M3 - Article (Academic Journal)

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