Residual stress measurement in thin films at sub-micron scale using Focused Ion Beam milling and imaging

Xu Song, Kong Boon Yeap, Jing Zhu, Jonathan Belnoue, Marco Sebastiani, Edoardo Bemporad, Kaiyang Zeng, Alexander M. Korsunsky

Research output: Contribution to journalArticle (Academic Journal)

31 Citations (Scopus)

Abstract

Residual stress evaluation in thin films at the sub-micron scale was achieved in the present study using a semi-destructive trench-cutting (ring-core) method. Focused Ion Beam was employed to introduce the strain relief by milling the slots around an "island" and also to record the images for strain change evaluation by digital image correlation analysis of micrographs. Finite element simulation was employed to predict the curves for strain relief as a function of milling depth, and compared with the experimental measurements, showing good agreement. An empirical mathematical description of the curves was proposed that allows efficient data analysis for residual stress evaluation. (C) 2011 Elsevier B.V. All rights reserved.

Original languageEnglish
Pages (from-to)2073-2076
Number of pages4
JournalThin Solid Films
Volume520
Issue number6
DOIs
Publication statusPublished - 1 Jan 2012

Cite this

Song, X., Yeap, K. B., Zhu, J., Belnoue, J., Sebastiani, M., Bemporad, E., Zeng, K., & Korsunsky, A. M. (2012). Residual stress measurement in thin films at sub-micron scale using Focused Ion Beam milling and imaging. Thin Solid Films, 520(6), 2073-2076. https://doi.org/10.1016/j.tsf.2011.10.211