Residual stresses due to cure and thermal shrinkage

Research output: Chapter in Book/Report/Conference proceeding › Conference Contribution (Conference Proceeding)

Translated title of the contribution	Residual stresses due to cure and thermal shrinkage
Original language	English
Title of host publication	6th International Conference on Structural Adhesives in Engineering (SAE-VI)
Publisher	Institute of Materials
Pages	139 - 142
ISBN (Print)	1861251491
Publication status	Published - 2001

Handle.net

@inproceedings{409a094e5ebe43c092c638db33fb63a6,

title = "Residual stresses due to cure and thermal shrinkage",

author = "RD Adams and H Yu",

year = "2001",

language = "English",

isbn = "1861251491",

pages = "139 -- 142",

booktitle = "6th International Conference on Structural Adhesives in Engineering (SAE-VI)",

publisher = "Institute of Materials",

}