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Reverse-biased induced mechanical stress in AlGaN/GaN power diodes

Research output: Chapter in Book/Report/Conference proceeding › Conference Contribution (Conference Proceeding)

5 Citations (Scopus)

Abstract

The piezoelectric stress distribution induced in the GaN layer of AlGaN/GaN Schottky Barrier Diodes (SBDs) under a DC reverse voltage of-250 V is directly measured using micro-Raman spectroscopy. The highest piezoelectric stress measurable near the anode fieldplate edge is 380 ± 40 MPa, which is similar to the stress measured in an AlGaN/GaN SBD under reverse-bias cycling at-400 V in a high voltage DC-DC boost converter circuit. Continuous operation of the SBD under this stress cycling condition may lead to cracking of the GaN layer and in turn degradation of the device, which may pose a reliability concern in such boost converter circuits.

Original languageEnglish
Title of host publicationProceedings of the International Symposium on Power Semiconductor Devices and ICs
PublisherInstitute of Electrical and Electronics Engineers (IEEE)
Pages103-106
Number of pages4
Volume2016-July
ISBN (Print)9781467387682
DOIs
Publication statusPublished - 25 Jul 2016
Event28th International Symposium on Power Semiconductor Devices and ICs, ISPSD 2016 - Prague, Czech Republic
Duration: 12 Jun 2016 → 16 Jun 2016

Conference

Conference28th International Symposium on Power Semiconductor Devices and ICs, ISPSD 2016
Country/TerritoryCzech Republic
CityPrague
Period12/06/16 → 16/06/16

Research Groups and Themes

  • CDTR

Keywords

  • AlGaN/GaN Schottky Barrier Diode
  • DC-DC boost converter
  • micro-Raman spectroscopy
  • piezoelectric stress

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