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RF power silicon-on-glass VDMOSFETs

  • N Nenadovic*
  • , [No Value] Cuoco
  • , SJCH Theeuwen
  • , H Schellevis
  • , G Spierings
  • , A Griffo
  • , M Pelk
  • , LK Nanver
  • , RFF Jos
  • , JW Slotboom
  • *Corresponding author for this work

    Research output: Contribution to journalArticle (Academic Journal)peer-review

    19 Citations (Scopus)

    Abstract

    Applicability of vertical double-diffused MOSFETs for future base station power amplifiers has been demonstrated by characterizing the first devices fabricated in a substrate transfer silicon-on-glass technology. For a gate length of 0.8 pm and gate width of 350 mum, the measured f(T)/f(max) is 6/10 GHz, and the breakdown voltage approaches 100 V. The devices feature an output power of 12 dBm at the 1-dB compression point, excellent linearity (IM3/IM5 of -50/ - 70 dBc at 10-dB backoff) and high power gain (14 dB) at 2 GHz, and are the first vertical DMOSFETs suitable for 2-GHz power applications. Excellent heat sinking and no significant degradation of the quiescent current due to hot-carrier injection ensure thermal stability and good long-term reliability of the fabricated devices.

    Original languageEnglish
    Pages (from-to)424-426
    Number of pages3
    JournalIEEE Electron Device Letters
    Volume25
    Issue number6
    DOIs
    Publication statusPublished - Jun 2004

    Keywords

    • substrate transfer
    • silicon-on-glass (SOG)
    • vertical double-diffused MOSFETs (VDMOSFET)
    • silicon RF power MOSFETs
    • self-heating

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