Abstract
Applicability of vertical double-diffused MOSFETs for future base station power amplifiers has been demonstrated by characterizing the first devices fabricated in a substrate transfer silicon-on-glass technology. For a gate length of 0.8 pm and gate width of 350 mum, the measured f(T)/f(max) is 6/10 GHz, and the breakdown voltage approaches 100 V. The devices feature an output power of 12 dBm at the 1-dB compression point, excellent linearity (IM3/IM5 of -50/ - 70 dBc at 10-dB backoff) and high power gain (14 dB) at 2 GHz, and are the first vertical DMOSFETs suitable for 2-GHz power applications. Excellent heat sinking and no significant degradation of the quiescent current due to hot-carrier injection ensure thermal stability and good long-term reliability of the fabricated devices.
| Original language | English |
|---|---|
| Pages (from-to) | 424-426 |
| Number of pages | 3 |
| Journal | IEEE Electron Device Letters |
| Volume | 25 |
| Issue number | 6 |
| DOIs | |
| Publication status | Published - Jun 2004 |
Keywords
- substrate transfer
- silicon-on-glass (SOG)
- vertical double-diffused MOSFETs (VDMOSFET)
- silicon RF power MOSFETs
- self-heating
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