Translated title of the contribution | Shrinkage and modulus measurement of epoxy resin during cure |
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Original language | English |
Title of host publication | Proc. International Conference on Adhesion |
Publication status | Published - 1995 |
Shrinkage and modulus measurement of epoxy resin during cure
H Yu, RD Adams
Research output: Chapter in Book/Report/Conference proceeding › Conference Contribution (Conference Proceeding)