Shrinkage and modulus measurement of epoxy resin during cure

H Yu, RD Adams

Research output: Chapter in Book/Report/Conference proceedingConference Contribution (Conference Proceeding)

Translated title of the contributionShrinkage and modulus measurement of epoxy resin during cure
Original languageEnglish
Title of host publicationProc. International Conference on Adhesion
Publication statusPublished - 1995

Bibliographical note

Other: Wuhan, China, November 1995

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