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Shrinkage and modulus measurement of epoxy resin during cure

    Research output: Chapter in Book/Report/Conference proceeding › Conference Contribution (Conference Proceeding)

    Translated title of the contributionShrinkage and modulus measurement of epoxy resin during cure
    Original languageEnglish
    Title of host publicationProc. International Conference on Adhesion
    Publication statusPublished - 1995

    Bibliographical note

    Other: Wuhan, China, November 1995

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