Slope analysis and scaling analysis of electrodeposited thin films

Lihu Liu, W. Schwarzacher*

*Corresponding author for this work

Research output: Contribution to journalArticle (Academic Journal)

6 Citations (Scopus)

Abstract

We introduce slope analysis as a straightforward complement to scaling analysis for characterizing the morphology of electrodeposited thin films. The surface slope theta, defined as the angle between the local surface normal and the film normal, is calculated as a function of position for electrodeposited Cu films of increasing thickness t. We show that the mean value of theta increases with t and demonstrate the close relationship between this observation and the increase in local roughness found in previous studies from scaling analysis. (c) 2013 Elsevier B.V. All rights reserved.

Original languageEnglish
Pages (from-to)52-54
Number of pages3
JournalElectrochemistry communications
Volume29
DOIs
Publication statusPublished - Apr 2013

Keywords

  • Metal electrodeposition
  • Cu
  • Surface roughness
  • Dynamic scaling
  • SURFACE-ROUGHNESS
  • DEPOSITION
  • GROWTH
  • CU
  • WIDTH

Cite this