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SPHERE in a Box: Practical and Scalable EurValve Activity Monitoring Smart Home Kit

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Original languageEnglish
Title of host publication2017 IEEE 42nd Conference on Local Computer Networks Workshops (LCN Workshops 2017)
Subtitle of host publicationProceedings of a meeting held 9 October 2017, Singapore
Publisher or commissioning bodyInstitute of Electrical and Electronics Engineers (IEEE)
Pages128-135
Number of pages8
ISBN (Electronic)9781509065844
ISBN (Print)9781509065851
DOIs
DateAccepted/In press - 16 Jul 2017
DateE-pub ahead of print - 16 Nov 2017
DatePublished (current) - Jan 2018

Abstract

Non-invasive, environmental monitoring is being successfully utilised to improve health care outcomes for patients while allowing them to more safely and comfortably live in their homes instead of health care facilities. This promises to reduce costs and ease the health care burden for many countries globally. However, these systems are still in early stages of research and only highly skilled researchers and engineers can successfully deploy them. The difficulty in deploying these systems prevents their mass use and potential cost savings motivating research interest in smart homes in a box (SHiB). In this paper we present the EurValve Activity Monitoring Kit, a minimalist activity monitoring system that can be deployed in a home by the patient and still obtain valuable lifestyle and activity level information for medical clinicians. We describe the design of the system and how it is being used in the H2020 EurValve Project. The initial results show that the system is easily deployed and yet still effective for non-invasive sensing for activity classification and localisation.

    Structured keywords

  • Digital Health

    Research areas

  • Digital Health

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  • Full-text PDF (accepted author manuscript)

    Rights statement: This is the author accepted manuscript (AAM). The final published version (version of record) is available online via IEEE at http://ieeexplore.ieee.org/document/8110214/ . Please refer to any applicable terms of use of the publisher.

    Accepted author manuscript, 2 MB, PDF document

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