Submicron YBa2Cu3O7-x bicrystal grain boundary junctions by focused ion beam

G Testa; A Monaco; E Sarnelli; A D'Agostino; DJ Kang; EJ Tarte; SH Mennema; C Bell; MG Blamire; Chris Bell

doi:10.1088/0953-2048/17/2/009

Submicron YBa2Cu3O7-x bicrystal grain boundary junctions by focused ion beam

G Testa^*, A Monaco, E Sarnelli, A D'Agostino, DJ Kang, EJ Tarte, SH Mennema, C Bell, MG Blamire, Chris Bell

^*Corresponding author for this work

School of Physics

Research output: Contribution to journal › Article (Academic Journal) › peer-review

14 Citations (Scopus)

Abstract

Submicron YBa2Cu3O7-x bicrystal grain boundary junctions have been fabricated, for the first time, by a focused ion beam process. Although such a process has always been considered detrimental to the YBa2Cu3O7-x because of gallium contamination, high quality 24degrees [001] tilt junctions characterized by RSJ current-voltage characteristics, ICRN products of the order of 1-4 x 10(4) A cm(-2) at 77 K and Fraunhofer-like modulation patterns have been obtained. No significant degradation has been observed over more than 3 months.

The critical current density J(C) and the characteristic voltage ICRN show a clear maximum for widths of the order of the Josephson penetration depth. The asymptotic normal resistance shows a typical (width)(-1) dependence, indicating that the FIB process does not increase the grain boundary resistivity of submicron junctions.

Experimental results clearly show that FIB is a very powerful tool for the fabrication of high critical temperature superconducting circuits, requiring a small number of submicron Josephson junctions, and for fundamental physics analysis. it also allow the final turning or repair of superconducting or more complex integrated superconducting-semiconducting devices.

Original language	English
Article number	PII S0953-2048(04)68941-X
Pages (from-to)	287-290
Number of pages	4
Journal	Superconductor Science and Technology
Volume	17
Issue number	2
DOIs	https://doi.org/10.1088/0953-2048/17/2/009
Publication status	Published - Feb 2004

Keywords

JOSEPHSON-JUNCTIONS
TRANSPORT-PROPERTIES
PARAMETER CONTROL
DC-SQUIDS
SUPERCONDUCTORS
FABRICATION
DEVICES
MGB2

Access to Document

10.1088/0953-2048/17/2/009

Handle.net

Persistent link

Cite this

@article{b06a850fb7bb4023a9aec66c8fba76b6,

title = "Submicron YBa2Cu3O7-x bicrystal grain boundary junctions by focused ion beam",

abstract = "Submicron YBa2Cu3O7-x bicrystal grain boundary junctions have been fabricated, for the first time, by a focused ion beam process. Although such a process has always been considered detrimental to the YBa2Cu3O7-x because of gallium contamination, high quality 24degrees [001] tilt junctions characterized by RSJ current-voltage characteristics, ICRN products of the order of 1-4 x 10(4) A cm(-2) at 77 K and Fraunhofer-like modulation patterns have been obtained. No significant degradation has been observed over more than 3 months.The critical current density J(C) and the characteristic voltage ICRN show a clear maximum for widths of the order of the Josephson penetration depth. The asymptotic normal resistance shows a typical (width)(-1) dependence, indicating that the FIB process does not increase the grain boundary resistivity of submicron junctions.Experimental results clearly show that FIB is a very powerful tool for the fabrication of high critical temperature superconducting circuits, requiring a small number of submicron Josephson junctions, and for fundamental physics analysis. it also allow the final turning or repair of superconducting or more complex integrated superconducting-semiconducting devices.",

keywords = "JOSEPHSON-JUNCTIONS, TRANSPORT-PROPERTIES, PARAMETER CONTROL, DC-SQUIDS, SUPERCONDUCTORS, FABRICATION, DEVICES, MGB2",

author = "G Testa and A Monaco and E Sarnelli and A D'Agostino and DJ Kang and EJ Tarte and SH Mennema and C Bell and MG Blamire and Chris Bell",

year = "2004",

month = feb,

doi = "10.1088/0953-2048/17/2/009",

language = "English",

volume = "17",

pages = "287--290",

journal = "Superconductor Science and Technology",

issn = "0953-2048",

publisher = "IOP Publishing",

number = "2",

}

TY - JOUR

T1 - Submicron YBa2Cu3O7-x bicrystal grain boundary junctions by focused ion beam

AU - Testa, G

AU - Monaco, A

AU - Sarnelli, E

AU - D'Agostino, A

AU - Kang, DJ

AU - Tarte, EJ

AU - Mennema, SH

AU - Bell, C

AU - Blamire, MG

AU - Bell, Chris

PY - 2004/2

Y1 - 2004/2

N2 - Submicron YBa2Cu3O7-x bicrystal grain boundary junctions have been fabricated, for the first time, by a focused ion beam process. Although such a process has always been considered detrimental to the YBa2Cu3O7-x because of gallium contamination, high quality 24degrees [001] tilt junctions characterized by RSJ current-voltage characteristics, ICRN products of the order of 1-4 x 10(4) A cm(-2) at 77 K and Fraunhofer-like modulation patterns have been obtained. No significant degradation has been observed over more than 3 months.The critical current density J(C) and the characteristic voltage ICRN show a clear maximum for widths of the order of the Josephson penetration depth. The asymptotic normal resistance shows a typical (width)(-1) dependence, indicating that the FIB process does not increase the grain boundary resistivity of submicron junctions.Experimental results clearly show that FIB is a very powerful tool for the fabrication of high critical temperature superconducting circuits, requiring a small number of submicron Josephson junctions, and for fundamental physics analysis. it also allow the final turning or repair of superconducting or more complex integrated superconducting-semiconducting devices.

AB - Submicron YBa2Cu3O7-x bicrystal grain boundary junctions have been fabricated, for the first time, by a focused ion beam process. Although such a process has always been considered detrimental to the YBa2Cu3O7-x because of gallium contamination, high quality 24degrees [001] tilt junctions characterized by RSJ current-voltage characteristics, ICRN products of the order of 1-4 x 10(4) A cm(-2) at 77 K and Fraunhofer-like modulation patterns have been obtained. No significant degradation has been observed over more than 3 months.The critical current density J(C) and the characteristic voltage ICRN show a clear maximum for widths of the order of the Josephson penetration depth. The asymptotic normal resistance shows a typical (width)(-1) dependence, indicating that the FIB process does not increase the grain boundary resistivity of submicron junctions.Experimental results clearly show that FIB is a very powerful tool for the fabrication of high critical temperature superconducting circuits, requiring a small number of submicron Josephson junctions, and for fundamental physics analysis. it also allow the final turning or repair of superconducting or more complex integrated superconducting-semiconducting devices.

KW - JOSEPHSON-JUNCTIONS

KW - TRANSPORT-PROPERTIES

KW - PARAMETER CONTROL

KW - DC-SQUIDS

KW - SUPERCONDUCTORS

KW - FABRICATION

KW - DEVICES

KW - MGB2

U2 - 10.1088/0953-2048/17/2/009

DO - 10.1088/0953-2048/17/2/009

M3 - Article (Academic Journal)

SN - 0953-2048

VL - 17

SP - 287

EP - 290

JO - Superconductor Science and Technology

JF - Superconductor Science and Technology

IS - 2

M1 - PII S0953-2048(04)68941-X

ER -

Submicron YBa2Cu3O7-x bicrystal grain boundary junctions by focused ion beam

Abstract

Keywords

Access to Document

Handle.net

Fingerprint

Cite this