TY - GEN
T1 - Temperature and diDS/dt dependence of the switching energy of SiC Schottky diodes in clamped inductive switching applications
AU - Jahdi, Saeed
AU - Alatise, Olayiwola
AU - Mawby, Phil A.
PY - 2014/1/1
Y1 - 2014/1/1
N2 - This paper presents the temperature and switching rate dependence of 1.2 kV/30 A SiC Schottky diode energy losses in clamped inductive switching circuits with 1.2 kV/30 A SiC MOSFETs as the switching transistors. The devices are tested under an ambient temperature range that spans from -75°C to 175°C and with switching rates that span from 10 to 100 A/μs. Due to the abruptness of the diode turn-OFF, low series resistance and the lack of reverse recovery, SiC SBDs are known to exhibit ringing or electromagnetic oscillations in the presence of parasitic inductances and high switching rates [1]. The impact of these electromagnetic oscillations on the switching energy, the dependence of the switching energy on temperature and the switching rate (diDS/dt) is the purpose of this paper's investigation.
AB - This paper presents the temperature and switching rate dependence of 1.2 kV/30 A SiC Schottky diode energy losses in clamped inductive switching circuits with 1.2 kV/30 A SiC MOSFETs as the switching transistors. The devices are tested under an ambient temperature range that spans from -75°C to 175°C and with switching rates that span from 10 to 100 A/μs. Due to the abruptness of the diode turn-OFF, low series resistance and the lack of reverse recovery, SiC SBDs are known to exhibit ringing or electromagnetic oscillations in the presence of parasitic inductances and high switching rates [1]. The impact of these electromagnetic oscillations on the switching energy, the dependence of the switching energy on temperature and the switching rate (diDS/dt) is the purpose of this paper's investigation.
KW - Clamped inductive switching
KW - Schottky barrier diodes
KW - Silicon carbide
KW - Switching energy
KW - Temperature dependence
UR - http://www.scopus.com/inward/record.url?scp=84896100388&partnerID=8YFLogxK
U2 - 10.4028/www.scientific.net/MSF.778-780.816
DO - 10.4028/www.scientific.net/MSF.778-780.816
M3 - Conference Contribution (Conference Proceeding)
AN - SCOPUS:84896100388
SN - 9783038350101
T3 - Materials Science Forum
SP - 816
EP - 819
BT - Silicon Carbide and Related Materials 2013
PB - Trans Tech Publications Inc
T2 - 15th International Conference on Silicon Carbide and Related Materials, ICSCRM 2013
Y2 - 29 September 2013 through 4 October 2013
ER -