Temperature and Switching Rate Dependence of Crosstalk in Si-IGBT and SiC Power Modules

The temperature and dV/dt dependence of crosstalk has been analyzed for Si-IGBT and SiC-MOSFET power modules. Due to a smaller Miller capacitance resulting from a smaller die area, the SiC module exhibits smaller shoot-through currents compared with similarly rated Si-IGBT modules in spite of switching with a higher dV/dt and with a lower threshold voltage. However, due to high voltage overshoots and ringing from the SiC Schottky diode, SiC modules exhibit higher shoot-through energy density and induce voltage oscillations in the dc link. Measurements show that the shoot-through current exhibits a positive temperature coefficient for both technologies, the magnitude of which is higher for the Si-IGBT, i.e., the shoot-through current and energy show better temperature stability in the SiC power module. The effectiveness of common techniques of mitigating shoot-through, including bipolar gate drives, multiple gate resistance switching paths, and external gate-source and snubber capacitors, has been evaluated for both technologies at different temperatures and switching rates. The results show that solutions are less effective for SiC-MOSFETs because of lower threshold voltages and smaller margins for negative gate bias on the SiC-MOSFET gate. Models for evaluating the parasitic voltage have also been developed for diagnostic and predictive purposes. These results are important for converter designers seeking to use SiC technology.