Tensile strength of joints bonded with a nano-particle- reinforced adhesive

SW Park, Byung Chul Kim, Dai Gil Lee

Research output: Contribution to journalArticle (Academic Journal)peer-review

32 Citations (Scopus)
Original languageEnglish
Pages (from-to)95-113
JournalJournal of Adhesion Science and Technology
Volume23
DOIs
Publication statusPublished - 2009

Structured keywords

  • Bristol Composites Institute ACCIS

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