Tensile strength of joints bonded with a nano-particle- reinforced adhesive

SW Park, Byung Chul Kim, Dai Gil Lee

Research output: Contribution to journal › Article (Academic Journal) › peer-review

42 Citations (Scopus)

Original language	English
Pages (from-to)	95-113
Journal	Journal of Adhesion Science and Technology
Volume	23
DOIs	https://doi.org/10.1163/156856108X344063
Publication status	Published - 2009

Research Groups and Themes

@article{b4628646b6de469980c62b1095421802,

title = "Tensile strength of joints bonded with a nano-particle- reinforced adhesive",

author = "SW Park and Kim, \{Byung Chul\} and Lee, \{Dai Gil\}",

year = "2009",

doi = "10.1163/156856108X344063",

language = "English",

volume = "23",

pages = "95--113",

journal = "Journal of Adhesion Science and Technology",

issn = "0169-4243",

publisher = "Taylor \& Francis Group",

}

TY - JOUR

T1 - Tensile strength of joints bonded with a nano-particle- reinforced adhesive

AU - Park, SW

AU - Kim, Byung Chul

AU - Lee, Dai Gil

PY - 2009

Y1 - 2009

U2 - 10.1163/156856108X344063

DO - 10.1163/156856108X344063

M3 - Article (Academic Journal)

SN - 0169-4243

VL - 23

SP - 95

EP - 113

JO - Journal of Adhesion Science and Technology

JF - Journal of Adhesion Science and Technology

ER -