The correlation between SEM imaging, 3-D topography and acoustic emmission spectra in determining surface and sub-surface crack propagation during ceramic grinding

T Maksoud; A Mokbel; JE Morgan

The correlation between SEM imaging, 3-D topography and acoustic emmission spectra in determining surface and sub-surface crack propagation during ceramic grinding

T Maksoud, A Mokbel, JE Morgan

Department of Mechanical Engineering

Research output: Chapter in Book/Report/Conference proceeding › Conference Contribution (Conference Proceeding)

Translated title of the contribution	The correlation between SEM imaging, 3-D topography and acoustic emmission spectra in determining surface and sub-surface crack propagation during ceramic grinding
Original language	English
Title of host publication	1999 International Mechanical Engineering Congress and Exposition, Symposium on Grinding and Abrasive Technologies
Publisher	American Society of Mechanical Engineers (ASME)
Pages	232 - 241
Volume	42
ISBN (Print)	079181646X
Publication status	Published - 2000

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Maksoud, T., Mokbel, A., & Morgan, JE. (2000). The correlation between SEM imaging, 3-D topography and acoustic emmission spectra in determining surface and sub-surface crack propagation during ceramic grinding. In 1999 International Mechanical Engineering Congress and Exposition, Symposium on Grinding and Abrasive Technologies (Vol. 42, pp. 232 - 241). American Society of Mechanical Engineers (ASME).

Maksoud, T ; Mokbel, A ; Morgan, JE. / The correlation between SEM imaging, 3-D topography and acoustic emmission spectra in determining surface and sub-surface crack propagation during ceramic grinding. 1999 International Mechanical Engineering Congress and Exposition, Symposium on Grinding and Abrasive Technologies. Vol. 42 American Society of Mechanical Engineers (ASME), 2000. pp. 232 - 241

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title = "The correlation between SEM imaging, 3-D topography and acoustic emmission spectra in determining surface and sub-surface crack propagation during ceramic grinding",

author = "T Maksoud and A Mokbel and JE Morgan",

year = "2000",

language = "English",

isbn = "079181646X",

volume = "42",

pages = "232 -- 241",

booktitle = "1999 International Mechanical Engineering Congress and Exposition, Symposium on Grinding and Abrasive Technologies",

publisher = "American Society of Mechanical Engineers (ASME)",

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Maksoud, T, Mokbel, A & Morgan, JE 2000, The correlation between SEM imaging, 3-D topography and acoustic emmission spectra in determining surface and sub-surface crack propagation during ceramic grinding. in 1999 International Mechanical Engineering Congress and Exposition, Symposium on Grinding and Abrasive Technologies. vol. 42, American Society of Mechanical Engineers (ASME), pp. 232 - 241.

The correlation between SEM imaging, 3-D topography and acoustic emmission spectra in determining surface and sub-surface crack propagation during ceramic grinding. / Maksoud, T; Mokbel, A; Morgan, JE.
1999 International Mechanical Engineering Congress and Exposition, Symposium on Grinding and Abrasive Technologies. Vol. 42 American Society of Mechanical Engineers (ASME), 2000. p. 232 - 241.

Research output: Chapter in Book/Report/Conference proceeding › Conference Contribution (Conference Proceeding)

TY - GEN

T1 - The correlation between SEM imaging, 3-D topography and acoustic emmission spectra in determining surface and sub-surface crack propagation during ceramic grinding

AU - Maksoud, T

AU - Mokbel, A

AU - Morgan, JE

PY - 2000

Y1 - 2000

M3 - Conference Contribution (Conference Proceeding)

SN - 079181646X

VL - 42

SP - 232

EP - 241

BT - 1999 International Mechanical Engineering Congress and Exposition, Symposium on Grinding and Abrasive Technologies

PB - American Society of Mechanical Engineers (ASME)

ER -

Maksoud T, Mokbel A, Morgan JE. The correlation between SEM imaging, 3-D topography and acoustic emmission spectra in determining surface and sub-surface crack propagation during ceramic grinding. In 1999 International Mechanical Engineering Congress and Exposition, Symposium on Grinding and Abrasive Technologies. Vol. 42. American Society of Mechanical Engineers (ASME). 2000. p. 232 - 241