The effect of compressive loading on the ultrasonic detectability of kissing bonds in adhesive joints

C. J. Brotherhood, B. W. Drinkwater*, F. J. Guild

*Corresponding author for this work

Research output: Contribution to journalArticle (Academic Journal)peer-review

41 Citations (Scopus)

Abstract

The effect of compressive loading on the ultrasonic detectability of kissing bonds in adhesive joints was studied. Two distinct types of kissing bond were considered. The first type was a dry contacting interface that represented a disbonded adhesive interface subsequently subjected to compressive loading. The second type were manufactured by contaminating the joint with a thin layer of various liquids. The interaction of normal incidence 10-MHz ultrasound with both these kissing bond types has been quantified. In particular the effect of compressive loading on their detectability was investigated. A quasistatic spring model has been used to predict the interaction of ultrasound with the solid-solid interfaces in the dry-contacting kissing bonds. The reasons for the discrepancy between the experiments and the model are discussed.

Original languageEnglish
Pages (from-to)95-104
Number of pages10
JournalJournal of Nondestructive Evaluation
Volume21
Issue number3
DOIs
Publication statusPublished - 1 Sep 2002

Keywords

  • Adhesive
  • Kissing bond
  • Reflection coefficient
  • Ultrasound

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