The effect of compressive loading on the ultrasonic detectability of kissing bonds in adhesive joints was studied. Two distinct types of kissing bond were considered. The first type was a dry contacting interface that represented a disbonded adhesive interface subsequently subjected to compressive loading. The second type were manufactured by contaminating the joint with a thin layer of various liquids. The interaction of normal incidence 10-MHz ultrasound with both these kissing bond types has been quantified. In particular the effect of compressive loading on their detectability was investigated. A quasistatic spring model has been used to predict the interaction of ultrasound with the solid-solid interfaces in the dry-contacting kissing bonds. The reasons for the discrepancy between the experiments and the model are discussed.
- Kissing bond
- Reflection coefficient