The effect of water desorption and organosilane coupling agents on the adhesion of poly(p-xylylene) films to a silicon wafer surface

PK Lightfoot, J Stejny

Research output: Contribution to journal › Article (Academic Journal) › peer-review

3 Citations (Scopus)

Translated title of the contribution	The effect of water desorption and organosilane coupling agents on the adhesion of poly(p-xylylene) films to a silicon wafer surface
Original language	English
Pages (from-to)	581 - 586
Journal	Journal of Materials Science: Materials in Electronics
Volume	12
Publication status	Published - 2001

Publisher: Kluwer Academic Publishers

Cite this

@article{fa52e97661294b59955b8534806b7a58,

title = "The effect of water desorption and organosilane coupling agents on the adhesion of poly(p-xylylene) films to a silicon wafer surface",

author = "PK Lightfoot and J Stejny",

note = "Publisher: Kluwer Academic Publishers",

year = "2001",

language = "English",

volume = "12",

pages = "581 -- 586",

journal = "Journal of Materials Science: Materials in Electronics",

issn = "0957-4522",

publisher = "Springer, New York, NY",

}

TY - JOUR

T1 - The effect of water desorption and organosilane coupling agents on the adhesion of poly(p-xylylene) films to a silicon wafer surface

AU - Lightfoot, PK

AU - Stejny, J

N1 - Publisher: Kluwer Academic Publishers

PY - 2001

Y1 - 2001

M3 - Article (Academic Journal)

VL - 12

SP - 581

EP - 586

JO - Journal of Materials Science: Materials in Electronics

JF - Journal of Materials Science: Materials in Electronics

SN - 0957-4522

ER -