Thermal Modeling of Fan-Cooled Plate-Fin Heatsink Considering Air Temperature Rise for Virtual Prototyping of Power Electronics

Lihong Xie, Xibo Yuan*, Wenbo Wang

*Corresponding author for this work

Research output: Contribution to journalArticle (Academic Journal)peer-review

5 Citations (Scopus)
Original languageEnglish
JournalIEEE Transactions on Components, Packaging and Manufacturing Technology
Early online date14 Jul 2020
DOIs
Publication statusE-pub ahead of print - 14 Jul 2020

Bibliographical note

The acceptance date for this record is provisional and based upon the month of publication for the article.

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