Thermal Modeling of Fan-Cooled Plate-Fin Heatsink Considering Air Temperature Rise for Virtual Prototyping of Power Electronics

Lihong Xie, Xibo Yuan^*, Wenbo Wang

^*Corresponding author for this work

Research output: Contribution to journal › Article (Academic Journal) › peer-review

Original language	English
Journal	IEEE Transactions on Components, Packaging and Manufacturing Technology
Early online date	14 Jul 2020
DOIs	https://doi.org/10.1109/TCPMT.2020.3009156
Publication status	E-pub ahead of print - 14 Jul 2020

The acceptance date for this record is provisional and based upon the month of publication for the article.

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title = "Thermal Modeling of Fan-Cooled Plate-Fin Heatsink Considering Air Temperature Rise for Virtual Prototyping of Power Electronics",

author = "Lihong Xie and Xibo Yuan and Wenbo Wang",

note = "The acceptance date for this record is provisional and based upon the month of publication for the article. ",

year = "2020",

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doi = "10.1109/TCPMT.2020.3009156",

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journal = "IEEE Transactions on Components, Packaging and Manufacturing Technology",

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T1 - Thermal Modeling of Fan-Cooled Plate-Fin Heatsink Considering Air Temperature Rise for Virtual Prototyping of Power Electronics

AU - Xie, Lihong

AU - Yuan, Xibo

AU - Wang, Wenbo

N1 - The acceptance date for this record is provisional and based upon the month of publication for the article.

PY - 2020/7/14

Y1 - 2020/7/14

U2 - 10.1109/TCPMT.2020.3009156

DO - 10.1109/TCPMT.2020.3009156

M3 - Article (Academic Journal)

JO - IEEE Transactions on Components, Packaging and Manufacturing Technology

JF - IEEE Transactions on Components, Packaging and Manufacturing Technology

ER -