Thermal Modeling of Fan-Cooled Plate-Fin Heatsink Considering Air Temperature Rise for Virtual Prototyping of Power Electronics

Lihong Xie, Xibo Yuan*, Wenbo Wang

*Corresponding author for this work

Research output: Contribution to journalArticle (Academic Journal)

Original languageEnglish
JournalIEEE Transactions on Components, Packaging and Manufacturing Technology
Publication statusE-pub ahead of print - 2020

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