@article{0ee5cbf4a09e4aa89d8dbdb617ae86df,
title = "Thermal Modeling of Fan-Cooled Plate-Fin Heatsink Considering Air Temperature Rise for Virtual Prototyping of Power Electronics",
author = "Lihong Xie and Xibo Yuan and Wenbo Wang",
note = "The acceptance date for this record is provisional and based upon the month of publication for the article. ",
year = "2020",
month = jul,
day = "14",
doi = "10.1109/TCPMT.2020.3009156",
language = "English",
journal = "IEEE Transactions on Components, Packaging and Manufacturing Technology",
issn = "2156-3985",
publisher = "Institute of Electrical and Electronics Engineers (IEEE)",
}