Thermal properties and reliability of GaN microelectronics: Sub-micron spatial and nanosecond time resolution thermography

M Kuball; JW Pomeroy; RJ Simms; G Riedel; H Ji; A Sarua; MJ Uren; T Martin

Thermal properties and reliability of GaN microelectronics: Sub-micron spatial and nanosecond time resolution thermography

M Kuball, JW Pomeroy, RJ Simms, G Riedel, H Ji, A Sarua, MJ Uren, T Martin

School of Physics

Research output: Chapter in Book/Report/Conference proceeding › Conference Contribution (Conference Proceeding)

18 Citations (Scopus)

Translated title of the contribution	Thermal properties and reliability of GaN microelectronics: Sub-micron spatial and nanosecond time resolution thermography
Original language	English
Title of host publication	4th IEEE Compound Semiconductor Integrated Circuit Symposium
Publisher	Institute of Electrical and Electronics Engineers (IEEE)
Pages	135 - 138
Number of pages	4
ISBN (Print)	9781424410224
Publication status	Published - 2007

Bibliographical note

Conference Proceedings/Title of Journal: IEEE Compound Semiconductor Integrated Circuit SYymposium - 2007 IEEE CSIC SYMPOSIUM, TECHNOLOGY DIGEST
Conference Organiser: IEEE

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Cite this

@inproceedings{d1ef5d998c3042689cf5f211a745c2c7,

title = "Thermal properties and reliability of GaN microelectronics: Sub-micron spatial and nanosecond time resolution thermography",

author = "M Kuball and JW Pomeroy and RJ Simms and G Riedel and H Ji and A Sarua and MJ Uren and T Martin",

note = "Conference Proceedings/Title of Journal: IEEE Compound Semiconductor Integrated Circuit SYymposium - 2007 IEEE CSIC SYMPOSIUM, TECHNOLOGY DIGEST Conference Organiser: IEEE",

year = "2007",

language = "English",

isbn = "9781424410224",

pages = "135 -- 138",

booktitle = "4th IEEE Compound Semiconductor Integrated Circuit Symposium",

publisher = "Institute of Electrical and Electronics Engineers (IEEE)",

address = "United States",

}

Thermal properties and reliability of GaN microelectronics: Sub-micron spatial and nanosecond time resolution thermography. / Kuball, M ; Pomeroy, JW; Simms, RJ et al.
4th IEEE Compound Semiconductor Integrated Circuit Symposium. Institute of Electrical and Electronics Engineers (IEEE), 2007. p. 135 - 138.

Research output: Chapter in Book/Report/Conference proceeding › Conference Contribution (Conference Proceeding)

TY - GEN

T1 - Thermal properties and reliability of GaN microelectronics: Sub-micron spatial and nanosecond time resolution thermography

AU - Kuball, M

AU - Pomeroy, JW

AU - Simms, RJ

AU - Riedel, G

AU - Ji, H

AU - Sarua, A

AU - Uren, MJ

AU - Martin, T

N1 - Conference Proceedings/Title of Journal: IEEE Compound Semiconductor Integrated Circuit SYymposium - 2007 IEEE CSIC SYMPOSIUM, TECHNOLOGY DIGEST Conference Organiser: IEEE

PY - 2007

Y1 - 2007

M3 - Conference Contribution (Conference Proceeding)

SN - 9781424410224

SP - 135

EP - 138

BT - 4th IEEE Compound Semiconductor Integrated Circuit Symposium

PB - Institute of Electrical and Electronics Engineers (IEEE)

ER -