Thick-SOI Echelle grating for any-to-any wavelength routing interconnection in multi-socket computing environments

G. Dabos, S. Pitris, C. Mitsolidou, T. Alexoudi, D. Fitsios, M. Cherchi, M. Harjanne, T. Aalto, G. T. Kanellos, N. Pleros

Research output: Chapter in Book/Report/Conference proceedingConference Contribution (Conference Proceeding)

7 Citations (Scopus)


As data centers constantly expand, electronic switches are facing the challenge of enhanced scalability and the request for increased pin-count and bandwidth. Photonic technology and wavelength division multiplexing have always been a strong alternative for efficient routing and their potential was already proven in the telecoms. CWDM transceivers have emerged in the board-to-board level interconnection, revealing the potential for wavelength-routing to be applied in the datacom and an AWGR-based approach has recently been proposed towards building an optical multi-socket interconnection to offer any-to-any connectivity with high aggregated throughput and reduced power consumption. Echelle gratings have long been recognized as the multiplexing block exhibiting smallest footprint and robustness in a wide number of applications compared to other alternatives such as the Arrayed Waveguide Grating. Such filtering devices can also perform in a similar way to cyclical AWGR and serve as mid-board routing platforms in multi-socket environments. In this communication, we present such a 3x3 Echelle grating integrated on thick SOI platform with aluminum-coated facets that is shown to perform successful wavelength-routing functionality at 10 Gb/s. The device exhibits a footprint of 60x270 μm2, while the static characterization showed a 3 dB on-chip loss for the best channel. The 3 dB-bandwidth of the channels was 4.5 nm and the free spectral range was 90 nm. The echelle was evaluated in a 2×2 wavelength routing topology, exhibiting a power penalty of below 0.4 dB at 10-9 BER for the C-band. Further experimental evaluations of the platform involve commercially available CWDM datacenter transceivers, towards emulating an optically-interconnected multi-socket environment traffic scenario.

Original languageEnglish
Title of host publicationOptical Interconnects XVII
PublisherSociety of Photo-Optical Instrumentation Engineers (SPIE)
ISBN (Electronic)9781510606593
Publication statusPublished - 1 Jan 2017
EventOptical Interconnects XVII - San Francisco, United States
Duration: 30 Jan 20171 Feb 2017


ConferenceOptical Interconnects XVII
CountryUnited States
CitySan Francisco


  • Cyclic wavelength routing
  • Echelle grating
  • Mid-board routing platform
  • Multi-socket interconnections
  • Thick-soi

Fingerprint Dive into the research topics of 'Thick-SOI Echelle grating for any-to-any wavelength routing interconnection in multi-socket computing environments'. Together they form a unique fingerprint.

Cite this