Through-Silicon Interposer (TSI) co-design optimization for high performance systems

Research output: Chapter in Book/Report/Conference proceeding › Conference Contribution (Conference Proceeding)

6 Citations (Scopus)

Original language	Undefined/Unknown
Title of host publication	2012 IEEE 14th Electronics Packaging Technology Conference (EPTC)
Pages	93-98
Number of pages	6
DOIs	https://doi.org/10.1109/EPTC.2012.6507058
Publication status	Published - 2012

Research Groups and Themes

@inproceedings{ec0f3acae3b54d78952b486d9cf4d059,

title = "Through-Silicon Interposer (TSI) co-design optimization for high performance systems",

author = "Cubillo, \{Joseph Romen\} and Roshan Weerasekera and Guruprasad Katti and Robert Patti",

year = "2012",

doi = "10.1109/EPTC.2012.6507058",

language = "Undefined/Unknown",

pages = "93--98",

booktitle = "2012 IEEE 14th Electronics Packaging Technology Conference (EPTC)",

}

TY - GEN

T1 - Through-Silicon Interposer (TSI) co-design optimization for high performance systems

AU - Cubillo, Joseph Romen

AU - Weerasekera, Roshan

AU - Katti, Guruprasad

AU - Patti, Robert

PY - 2012

Y1 - 2012

U2 - 10.1109/EPTC.2012.6507058

DO - 10.1109/EPTC.2012.6507058

M3 - Conference Contribution (Conference Proceeding)

SP - 93

EP - 98

BT - 2012 IEEE 14th Electronics Packaging Technology Conference (EPTC)

ER -