Through-thickness sensing of single Z-pin reinforced composite laminates

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Abstract

This paper investigates the through-thickness sensing behaviour of carbon/BMI Z-pin reinforced composite laminates. The through-thickness electrical resistance (TTER) is used as the sensing variable. Electrodes are bonded to the Z-pin ends and the TTER is measured employing a sensor reading and analysing (SRA) system. The SRA system consists of a multiplexer, a digital multimeter, communication modules and a PC running the National Instruments LabVIEW program for the control of the whole system and the TTER data acquisition. The sensing capability of through-thickness reinforced laminates is characterised via single Z-pin bridging tests, carried out in Mode I and Mode II. The experimental results show that the whole Mode I pullout process of Z-pins can be monitored via the TTER variation. In mode II, no actual pullout occurs and the Z-pins experience failure while bridging the delamination. However, the Z-pin failure event is detectable as a sudden increase of the TTER. This study demonstrates that carbon/BMI Z-pins can be successfully employed in multi- functional applications involving simultaneous delamination bridging and structural health monitoring.
Original languageEnglish
Title of host publicationProceedings of the 20th International Conference on Composite Materials (ICCM20)
PublisherInternational Conference on Composite Materials, ICCM
Number of pages7
Publication statusPublished - 24 Jul 2015
Event20th International Conference on Composite Materials (ICCM20) - Copenhagen, Denmark
Duration: 19 Jul 201524 Jul 2015

Conference

Conference20th International Conference on Composite Materials (ICCM20)
CountryDenmark
CityCopenhagen
Period19/07/1524/07/15

Structured keywords

  • Composites UTC

Keywords

  • Delamination
  • Multifunctional composites
  • Sensing
  • Z-pins

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