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Through-thickness sensing of single Z-pin reinforced composite laminates

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Original languageEnglish
Title of host publicationProceedings of the 20th International Conference on Composite Materials (ICCM20)
Publisher or commissioning bodyInternational Conference on Composite Materials, ICCM
Number of pages7
DateAccepted/In press - 13 Feb 2015
DatePublished (current) - 24 Jul 2015
Event20th International Conference on Composite Materials (ICCM20) - Copenhagen, Denmark
Duration: 19 Jul 201524 Jul 2015


Conference20th International Conference on Composite Materials (ICCM20)


This paper investigates the through-thickness sensing behaviour of carbon/BMI Z-pin reinforced composite laminates. The through-thickness electrical resistance (TTER) is used as the sensing variable. Electrodes are bonded to the Z-pin ends and the TTER is measured employing a sensor reading and analysing (SRA) system. The SRA system consists of a multiplexer, a digital multimeter, communication modules and a PC running the National Instruments LabVIEW program for the control of the whole system and the TTER data acquisition. The sensing capability of through-thickness reinforced laminates is characterised via single Z-pin bridging tests, carried out in Mode I and Mode II. The experimental results show that the whole Mode I pullout process of Z-pins can be monitored via the TTER variation. In mode II, no actual pullout occurs and the Z-pins experience failure while bridging the delamination. However, the Z-pin failure event is detectable as a sudden increase of the TTER. This study demonstrates that carbon/BMI Z-pins can be successfully employed in multi- functional applications involving simultaneous delamination bridging and structural health monitoring.

    Research areas

  • Delamination, Multifunctional composites, Sensing, Z-pins

    Structured keywords

  • Composites UTC


20th International Conference on Composite Materials (ICCM20)

Duration19 Jul 201524 Jul 2015
Degree of recognitionInternational event

Event: Conference

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