Time–frequency analysis for ultrasonic measurement of liquid layer thickness

Jingpin Jiao, Wenhua Liu, Qiang Zhang, Jie Zhang, Cunfu He, Bin Wu

Research output: Contribution to journal › Article (Academic Journal) › peer-review

33 Citations (Scopus)

Original language	English
Pages (from-to)	69-83
Journal	Mechanical Systems and Signal Processing
Publication status	Published - 2013

Handle.net

@article{a7360b7dfa9d41b8bbdde18abb6d802f,

title = "Time–frequency analysis for ultrasonic measurement of liquid layer thickness",

author = "Jingpin Jiao and Wenhua Liu and Qiang Zhang and Jie Zhang and Cunfu He and Bin Wu",

year = "2013",

language = "English",

pages = "69--83",

journal = "Mechanical Systems and Signal Processing",

issn = "0888-3270",

publisher = "Academic Press",

}

TY - JOUR

T1 - Time–frequency analysis for ultrasonic measurement of liquid layer thickness

AU - Jiao, Jingpin

AU - Liu, Wenhua

AU - Zhang, Qiang

AU - Zhang, Jie

AU - He, Cunfu

AU - Wu, Bin

PY - 2013

Y1 - 2013

M3 - Article (Academic Journal)

SN - 0888-3270

SP - 69

EP - 83

JO - Mechanical Systems and Signal Processing

JF - Mechanical Systems and Signal Processing

ER -