TSV-based PUF circuit for 3DIC sensor nodes in IoT applications

Research output: Chapter in Book/Report/Conference proceeding › Conference Contribution (Conference Proceeding)

9 Citations (Scopus)

Original language	Undefined/Unknown
Title of host publication	2015 IEEE International Conference on Electron Devices and Solid-State Circuits (EDSSC)
Pages	313-316
Number of pages	4
DOIs	https://doi.org/10.1109/EDSSC.2015.7285113
Publication status	Published - 2015

Research Groups and Themes

@inproceedings{e80f8af4ad9a4abbb40ed4964f25fa7e,

title = "TSV-based PUF circuit for 3DIC sensor nodes in IoT applications",

author = "Chao Wang and Jun Zhou and Katti Guruprasad and Xin Liu and Roshan Weerasekera and Kim, \{Tony T.\}",

year = "2015",

doi = "10.1109/EDSSC.2015.7285113",

language = "Undefined/Unknown",

pages = "313--316",

booktitle = "2015 IEEE International Conference on Electron Devices and Solid-State Circuits (EDSSC)",

}

TY - GEN

T1 - TSV-based PUF circuit for 3DIC sensor nodes in IoT applications

AU - Wang, Chao

AU - Zhou, Jun

AU - Guruprasad, Katti

AU - Liu, Xin

AU - Weerasekera, Roshan

AU - Kim, Tony T.

PY - 2015

Y1 - 2015

U2 - 10.1109/EDSSC.2015.7285113

DO - 10.1109/EDSSC.2015.7285113

M3 - Conference Contribution (Conference Proceeding)

SP - 313

EP - 316

BT - 2015 IEEE International Conference on Electron Devices and Solid-State Circuits (EDSSC)

ER -