Wafer surface reconstruction from top-down scanning electron microscope images

E Gelenbe, T Koçak, R Wang

Research output: Contribution to journal › Article (Academic Journal) › peer-review

25 Citations (Scopus)

Translated title of the contribution	Wafer surface reconstruction from top-down scanning electron microscope images
Original language	English
Pages (from-to)	216 - 233
Number of pages	18
Journal	Microelectronic Engineering
Volume	75 (2)
DOIs	https://doi.org/10.1016/j.mee.2004.05.006
Publication status	Published - Aug 2004

Publisher: Elsevier

Access to Document

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title = "Wafer surface reconstruction from top-down scanning electron microscope images",

author = "E Gelenbe and T Ko{\c c}ak and R Wang",

note = "Publisher: Elsevier",

year = "2004",

month = aug,

doi = "10.1016/j.mee.2004.05.006",

language = "English",

volume = "75 (2)",

pages = "216 -- 233",

journal = "Microelectronic Engineering",

publisher = "Elsevier B.V.",

}

TY - JOUR

T1 - Wafer surface reconstruction from top-down scanning electron microscope images

AU - Gelenbe, E

AU - Koçak, T

AU - Wang, R

N1 - Publisher: Elsevier

PY - 2004/8

Y1 - 2004/8

U2 - 10.1016/j.mee.2004.05.006

DO - 10.1016/j.mee.2004.05.006

M3 - Article (Academic Journal)

VL - 75 (2)

SP - 216

EP - 233

JO - Microelectronic Engineering

JF - Microelectronic Engineering

ER -