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A highly sensitive pressure sensor using conductive composite elastomers with wavy structures

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Original languageEnglish
Title of host publicationProceedings of SPIE - The International Society for Optical Engineering
EditorsBrian Cullum, Douglas Kiehl, Eric McLamore
Publisher or commissioning bodySociety of Photo-Optical Instrumentation Engineers (SPIE)
Number of pages6
ISBN (Print)9781510601048
DateAccepted/In press - 12 Apr 2016
DatePublished (current) - 13 May 2016
EventSmart Biomedical and Physiological Sensor Technology XIII - Baltimore, United States
Duration: 18 Apr 201619 Apr 2016

Publication series

NameProceedings of SPIE
PublisherSociety of Photo-optical Instrumentation Engineers (SPIE)
ISSN (Print)0277-786X
ISSN (Electronic)1996-756X


ConferenceSmart Biomedical and Physiological Sensor Technology XIII
CountryUnited States


Flexible pressure sensors are crucial components for the next generation wearable devices to monitor human physiological conditions. In this paper, we present a novel resistive pressure sensor based on hybrid composites made from carbon nanotube (CNT) for the conductive coating layer and polydimethylsiloxane (PDMS) elastomers as the substrate. The high sensitivity of these sensors is attributed to the change of contact resistance caused by the variation of the contact areas between the wavy film and the electrodes. Porous electrodes were designed to increase the roughness of the interfaces, thus further enhancing the pressure sensitivity. The developed device was verified through a series of tests, and the sensor exhibited a high sensitivity of 2.05 kPa-1 under a low pressure of 35.6 Pa.

    Structured keywords

  • Tactile Action Perception

    Research areas

  • Contact resistance, Nanocomposites, Porous electrodes, Pressure sensor, Wavy structure


Smart Biomedical and Physiological Sensor Technology XIII

Duration18 Apr 201619 Apr 2016
CountryUnited States
SponsorsThe Society of Photo-Optical Instrumentation Engineers (SPIE) (External organisation)

Event: Conference

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  • Full-text PDF (accepted author manuscript)

    Rights statement: This is the author accepted manuscript (AAM). The final published version (version of record) is available online via SPIE at Please refer to any applicable terms of use of the publisher.

    Accepted author manuscript, 4.61 MB, PDF document

    Licence: CC BY-NC


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