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System level 5G evaluation of MIMO-GFDM in an LTE-A platform

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Original languageEnglish
Title of host publication 2017 24th International Conference on Telecommunications (ICT)
Publisher or commissioning bodyInstitute of Electrical and Electronics Engineers (IEEE)
Number of pages5
ISBN (Electronic) 9781538606438
ISBN (Print)9781538606445
DOIs
DateAccepted/In press - 31 Mar 2017
DateE-pub ahead of print (current) - 3 Aug 2017
Event 2017 24th International Conference on Telecommunications (ICT) - Limassol, Cyprus
Duration: 3 May 20175 May 2017

Conference

Conference 2017 24th International Conference on Telecommunications (ICT)
CountryCyprus
City Limassol
Period3/05/175/05/17

Abstract

The 5G physical layer will support applications with different requirements, such as high data rate, ultra low power consumption and low latency. Recently, there is significant interest in the design and performance of new waveforms for 5G. One of the most important candidates is the Generalised Frequency Division Multiplexing (GFDM) waveform. The new waveform must support a smooth transition from current 4G solutions. In this paper, the performance of MIMO-GFDM with spatial multiplexing is studied in the context of LTE-A using the 3D 3GPP-ITU channel model. Additionally, results are compared with corresponding OFDM solutions. Our investigations illustrate that GFDM achieves comparable performance (Packet Error Rate (PER) and throughput), while offering additional gains such as decreased out-of-band radiation, which is a key factor for many 5G applications such as M2M and IoT.

    Research areas

  • GFDM, MIMO, OFDM, LTE-A

Event

2017 24th International Conference on Telecommunications (ICT)

Duration3 May 20175 May 2017
City Limassol
CountryCyprus

Event: Conference

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Documents

  • Full-text PDF (accepted author manuscript)

    Rights statement: This is the author accepted manuscript (AAM). The final published version (version of record) is available online via IEEE at . Please refer to any applicable terms of use of the publisher.

    Accepted author manuscript, 733 KB, PDF document

DOI

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